Chemical liquid, chemical liquid storage body, chemical liquid filling method, and chemical liquid storage method

ABSTRACT

An object of the present invention is to provide a chemical liquid having excellent developability and excellent defect inhibition performance. Another object of the present invention is to provide a chemical liquid storage body, a chemical liquid filling method, and a chemical liquid storage method. The chemical liquid according to an embodiment of the present invention is a chemical liquid containing an organic solvent, a metal impurity, and an organic impurity, in which the metal impurity contains metal atoms, a total content of the metal atoms in the chemical liquid with respect to a total mass of the chemical liquid is equal to or smaller than 50 mass ppt, a total content of the organic impurity in the chemical liquid with respect to the total mass of the chemical liquid is 0.1 to 10,000 mass ppm, the organic impurity contains an alcohol impurity, and a mass ratio of a content of the alcohol impurity to the total content of the organic impurity is 0.0001 to 0.5.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of PCT International Application No.PCT/JP2017/030885 filed on Aug. 29, 2017, which claims priority under 35U.S.C. § 119(a) to Japanese Patent Application No. 2016-188273 filed onSep. 27, 2016. The above application is hereby expressly incorporated byreference, in its entirety, into the present application.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a chemical liquid, a chemical liquidstorage body, a chemical liquid filling method, and a chemical liquidstorage method.

2. Description of the Related Art

Conventionally, in a process of manufacturing a semiconductor devicesuch as an Integrated Circuit (IC) or a Large Scale Integrated circuit(LSI), microfabrication is performed by a photolithography process byusing a photoresist composition.

In the photolithography process, a coating film is formed of aphotoresist composition (an actinic ray-sensitive or radiation-sensitiveresin composition which is also called chemical amplification-typeresist composition), the obtained coating film is then exposed and thendeveloped using a developer so as to obtain a pattern-like cured film,and the developed cured film is washed with a rinse solution. Inaddition, in order to improve the wettability of the photoresistcomposition with respect to a substrate, before the substrate is coatedwith the photoresist composition, a prewet solution is brought intocontact with the surface of the substrate.

It is apprehended that in the aforementioned semiconductor devicemanufacturing process, the mixing of particles having a size of severalmicrometers may cause a defect failure in the semiconductor device.Therefore, raw materials, solvents, or the like used in thesemiconductor device manufacturing process are required to have highpurity.

JP2015-007807A describes “an organic treatment solution for patterning achemical amplification-type resist film, containing an alkylolefinhaving 22 or less carbon atoms in an amount equal to or smaller than 1ppm, in which the concentration of all the metal elements of Na, K, Ca,Fe, Cu, Mg, Mn, Li, Al, Cr, Ni, and Zn is equal to or lower than 5 ppm,the organic treatment solution is an organic developer, and the totalmoisture content in the developer is less than 10% by mass”.

SUMMARY OF THE INVENTION

In recent years, the chemical liquid used in the photolithographyprocess has been required to exhibit further improved developability anddefect inhibition performance in a case where the chemical liquid isused, for example, as a developer, a prewet solution, and the like.Meanwhile, the inventors of the present invention examined the organictreatment solution for patterning a chemical amplification-type resistfilm described in JP2015-007807A. As a result, the inventors have foundthat the developability and the defect inhibition performance need to befurther improved.

An object of the present invention is to provide a chemical liquid whichexhibits excellent developability and excellent defect inhibitionperformance in a case where the chemical liquid is used as a prewetsolution, a developer, and the like. Another object of the presentinvention is to provide a chemical liquid storage body, a chemicalliquid filling method, and a chemical liquid storage method.

In the present specification, the developability and the defectinhibition performance mean the physical properties of a chemical liquidthat can be measured by the method described in Examples.

In order to achieve the aforementioned objects, the inventors of thepresent invention carried out an intensive examination. As a result, theinventors have found that the objects can be achieved by the followingconstitution.

[1] A chemical liquid comprising an organic solvent, a metal impurity,and an organic impurity, in which the metal impurity contains metalatoms, a total content of the metal atoms in the chemical liquid withrespect to a total mass of the chemical liquid is equal to or smallerthan 50 mass ppt, a total content of the organic impurity in thechemical liquid with respect to the total mass of the chemical liquid is0.1 to 10,000 mass ppm, the organic impurity contains an alcoholimpurity, and a mass ratio of a content of the alcohol impurity to thetotal content of the organic impurity is 0.0001 to 0.5.

[2] The chemical liquid described in [1], in which the metal impuritycontains a Fe atom, a Ni atom, a Cr atom, and a Pb atom, a mass ratio ofa content of the Fe atom to the total content of the metal atoms is 0.01to 0.5, a mass ratio of a content of the Cr atom to the total content ofthe metal atoms is 0.01 to 0.5, a mass ratio of a content of the Ni atomto the total content of the metal atoms is 0.01 to 0.5, and a mass ratioof a content of the Pb atom to the total content of the metal atoms is0.005 to 0.3.

[3] The chemical liquid described in [1] or [2], in which a mass ratioof a total content of a component having a boiling point equal to orhigher than 250° C. to a total content of a component having a boilingpoint lower than 250° C. in the chemical liquid is 0.00001 to 0.001.

[4] The chemical liquid described in any one of [1] to [3], in which acontent of water in the chemical liquid with respect to the total massof the chemical liquid is 0.1% to 1.5% by mass.

[5] The chemical liquid described in any one of [1] to [4], in which thenumber of objects to be counted having a size equal to or greater than0.1 μm that are counted by a light scattering-type liquid-borne particlecounter is equal to or smaller than 100/mL.

[6] The chemical liquid described in any one of [1] to [5], in which theorganic solvent has a boiling point lower than 200° C.

[7] The chemical liquid described in any one of [1] to [6], in which theorganic solvent contains at least one kind of compound selected from thegroup consisting of propylene glycol monomethyl ether, propylene glycolmonoethyl ether, propylene glycol monopropyl ether, propylene glycolmonomethyl ether acetate, ethyl lactate, methyl methoxypropionate, hexylalcohol, 2-heptanone, isoamyl acetate, cyclopentanone, cyclohexanone,γ-butyrolactone, diisoamyl ether, butyl acetate, 2-hydroxymethylbutyrate, cyclohexanone dimethyl acetal, and 4-methyl-2-pentanol.

[8] A chemical liquid storage body comprising a storage tank and thechemical liquid described in any one of [1] to [7] that is stored in thestorage tank, in which a liquid contact portion contacting the chemicalliquid in the storage tank is formed of a nonmetallic material orelectropolished stainless steel.

[9] The chemical liquid storage body, in which the nonmetallic materialis at least one kind of material selected from the group consisting of apolyethylene resin, a polypropylene resin, a polyethylene-polypropyleneresin, polytetrafluoroethylene, a tetrafluoroethylene-perfluoroalkylvinyl ether copolymer, a tetrafluoroethylene-hexafluoropropylenecopolymer resin, a tetrafluoroethylene-ethylene copolymer resin, achlorotrifluoro ethylene-ethylene copolymer resin, a vinylidene fluorideresin, a chlorotrifluoroethylene copolymer resin, and a vinyl fluorideresin.

[10] A chemical liquid filling method for filling a storage tank withthe chemical liquid described in any one of [1] to [7] by transferringthe chemical liquid to the storage tank from a tank lorry including atank storing the chemical liquid, comprising a step of connecting thetank and the storage tank to each other through a first connectionmember, and a step of filling the storage tank with the chemical liquidin the tank by transferring the chemical liquid to the storage tankthrough the first connection member.

[11] The chemical liquid filling method described in [10], in which thefirst connection member is a member satisfying a condition 1 or acondition 2 described below.

Condition 1: under a condition in which a ratio of a mass of the firstconnection member to a volume of the chemical liquid transferred to andfilled into the storage tank becomes 10% provided that a liquidtemperature of the chemical liquid is 25° C., in a case where the firstconnection member is immersed for 1 week in the chemical liquid having aliquid temperature of 25° C., the total content of the metal atomscontained in the metal impurity eluted into the chemical liquid is equalto or smaller than 1.0 mass ppt.

Condition 2: under a condition in which a ratio of a mass of the firstconnection member to a volume of the chemical liquid transferred to andfilled into the storage tank becomes 10% provided that a liquidtemperature of the chemical liquid is 25° C., in a case where the firstconnection member is immersed for 1 week in the chemical liquid having aliquid temperature of 25° C., the total content of the organic impurityeluted into the chemical liquid is equal to or smaller than 1.0 massppt.

[12] The chemical liquid filling method described in [10] or [11], inwhich a liquid contact portion, which contacts the chemical liquid, ofat least one kind of constituent selected from the group consisting ofthe tank, the storage tank, and the first connection member is formed ofa nonmetallic material or electropolished stainless steel.

[13] The chemical liquid filling method described in [12], in which thenonmetallic material is at least one kind of material selected from thegroup consisting of a polyethylene resin, a polypropylene resin, apolyethylene-polypropylene resin, polytetrafluoroethylene, atetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, atetrafluoroethylene-hexafluoropropylene copolymer resin, atetrafluoroethylene-ethylene copolymer resin, a chlorotrifluoroethylene-ethylene copolymer resin, a vinylidene fluoride resin, achlorotrifluoroethylene copolymer resin, and a vinyl fluoride resin.

[14] The chemical liquid filling method described in any one of [10] to[13], further comprising a step of transferring the chemical liquid,which has been transferred to and filled into the storage tank, to asupply tank, which is connected to the storage tank through a secondconnection member, through the second connection member such that thesupply tank is filled with the chemical liquid.

[15] The chemical liquid filling method described in [14], in which aliquid contact portion, which contacts the chemical liquid, of at leastone kind of constituent selected from the group consisting of the supplytank and the second connection member is formed of a nonmetallicmaterial or electropolished stainless steel.

[16] The chemical liquid filling method described in [15], in which thenonmetallic material is at least one kind of material selected from thegroup consisting of a polyethylene resin, a polypropylene resin, apolyethylene-polypropylene resin, polytetrafluoroethylene, atetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, atetrafluoroethylene-hexafluoropropylene copolymer resin, atetrafluoroethylene-ethylene copolymer resin, a chlorotrifluoroethylene-ethylene copolymer resin, a vinylidene fluoride resin, achlorotrifluoroethylene copolymer resin, and a vinyl fluoride resin.

[17] The chemical liquid filling method described in any one of [14] to[16], further comprising a step of transferring the chemical liquid,which has been transferred to and filled into the supply tank, to adevice, which is connected to the supply tank through a third connectionmember, through the third connection member such that the device isfilled with the chemical liquid.

[18] The chemical liquid filling method described in [17], in which aliquid contact portion, which contacts the chemical liquid, of at leastone kind of constituent selected from the group consisting of the deviceand the third connection member is formed of a nonmetallic material orelectropolished stainless steel.

[19] The chemical liquid filling method described in [18], in which thenonmetallic material is at least one kind of material selected from thegroup consisting of a polyethylene resin, a polypropylene resin, apolyethylene-polypropylene resin, polytetrafluoroethylene, atetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, atetrafluoroethylene-hexafluoropropylene copolymer resin, atetrafluoroethylene-ethylene copolymer resin, a chlorotrifluoroethylene-ethylene copolymer resin, a vinylidene fluoride resin, achlorotrifluoroethylene copolymer resin, and a vinyl fluoride resin.

[20] The chemical liquid filling method described in any one of [17] to[19], in which the third connection member includes at least one kind offilter.

[21] A chemical liquid storage method for storing the chemical liquiddescribed in any one of [1] to [7] that is stored in the storage tank,comprising an adjustment step of adjusting at least one kind of itemselected from the group consisting of a temperature of the chemicalliquid, an internal pressure of the storage tank, and a relativehumidity of a headspace portion in the storage tank.

[22] The chemical liquid storage method described in [21], in which aliquid contact portion, which contacts the chemical liquid, of thestorage tank is formed of a nonmetallic material or electropolishedstainless steel.

[23] The chemical liquid storage method described in [22], in which thenonmetallic material is at least one kind of material selected from thegroup consisting of a polyethylene resin, a polypropylene resin, apolyethylene-polypropylene resin, polytetrafluoroethylene, atetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, atetrafluoroethylene-hexafluoropropylene copolymer resin, atetrafluoroethylene-ethylene copolymer resin, a chlorotrifluoroethylene-ethylene copolymer resin, a vinylidene fluoride resin, achlorotrifluoroethylene copolymer resin, and a vinyl fluoride resin.

[24] The chemical liquid storage method described in any one of [21] to[23], in which the adjustment step has a step of adjusting thetemperature to be 10° C. to 30° C., a step of adjusting the internalpressure to be 0.1 to 1.0 MPa, and a step of adjusting the relativehumidity to be 30% to 90%.

According to the present invention, it is possible to provide a chemicalliquid which exhibits excellent developability and excellent defectinhibition performance in a case where the chemical liquid is used as aprewet solution, a developer, and the like. Furthermore, the presentinvention can also provide a chemical liquid storage body, a chemicalliquid filling method, and a chemical liquid storage method.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view showing an aspect of a method for filling astorage tank with a chemical liquid by transferring the chemical liquidto the storage tank from a tank lorry.

FIG. 2 is a schematic view showing an aspect of a method for filling asupply tank with a chemical liquid by transferring the chemical liquidto the supply tank from a storage tank and a method for filling a devicewith the chemical liquid by transferring the chemical liquid to thedevice from the supply tank.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, the present invention will be specifically described.

The following constituents will be described based on typicalembodiments of the present invention in some cases, but the presentinvention is not limited to the embodiments.

In the present specification, a range of numerical values describedusing “to” means a range including the numerical values listed beforeand after “to” as a lower limit and an upper limit respectively.

In the present invention, “preparation” means not only the preparationof a specific material by means of synthesis or mixing but also thepreparation of a predetermined substance by means of purchase and thelike.

In the present specification, “ppm” means “parts-per-million (10⁻⁶)”,“ppb” means “parts-per-billion (10⁻⁹)”, “ppt” means “parts-per-trillion(10⁻¹²)”, and “ppq” means “parts-per-quadrillion (10⁻¹⁵)”.

In the present invention, 1 Å (angstrom) equals 0.1 nm.

In the present invention, regarding the description of a group (atomicgroup), in a case where whether the group is substituted orunsubstituted is not described, as long as the effects of the presentinvention are not impaired, the group includes a group which does nothave a substituent and a group which has a substituent. For example,“hydrocarbon group” includes not only a hydrocarbon group which does nothave a substituent (unsubstituted hydrocarbon group) but also ahydrocarbon group which has a substituent (substituted hydrocarbongroup). The same is true for each compound.

Furthermore, in the present invention, “radiation” means, for example,far ultraviolet rays, extreme ultraviolet (EUV), X-rays, electron beams,and the like. In addition, in the present invention, light means actinicrays or radiation. In the present invention, unless otherwise specified,“exposure” includes not only exposure, far ultraviolet rays, X-rays, andEUV, and the like, but also lithography by particle beams such aselectron beams or ion beams.

[Chemical Liquid]

The aforementioned chemical liquid is a chemical liquid containing anorganic solvent, a metal impurity, and an organic impurity. One of thecharacteristics of the chemical liquid is that the total content of theorganic impurity in the chemical liquid with respect to the total massof the chemical liquid is 0.1 to 10,000 mass ppm, the organic impuritycontains an alcohol impurity, and a mass ratio of the content of thealcohol impurity in the chemical liquid to the total content of theorganic impurity in the chemical liquid is 0.0001 to 0.5.

According to the examination conducted by the inventors of the presentinvention, it has been revealed in a case where the chemical liquid, inwhich the mass ratio of the content of the alcohol impurity in thechemical liquid to the total content of the organic impurity is lessthan 0.0001, is used as a negative developer, the time taken fordevelopment increases. Presumably, this is because the alcohol impurityhaving high polarity may fail to accelerate the development.

Furthermore, it has been revealed that in a case where the chemicalliquid, in which the mass ratio is less than 0.0001, is used as a prewetsolution, coating properties deteriorate in some cases. Presumably, thisis because the alcohol impurity may fail to reduce the viscosity of thechemical liquid.

In contrast, it has been revealed that in a case where the chemicalliquid, in which the mass ratio is higher than 0.5, is used as anegative developer, development proceeds further than intended in somecases. Presumably, this is because the alcohol impurity having highpolarity may excessively accelerate development.

In addition, it has been revealed that in a case where the chemicalliquid, in which the mass ratio is higher than 0.5, is used as a prewetsolution, and coating is performed using a composition for forming aresist film, a resin component frequently contained in the compositionfor forming a resist film is precipitated, and defect inhibitionperformance deteriorate in some cases. Presumably, this is because thesolubility of the resin component may be reduced by the alcoholimpurity.

Presumably, because the chemical liquid contains the metal impurity andthe organic impurity, and the mass ratio of the content of the alcoholimpurity in the organic impurity to the total content of the organicimpurity is adjusted to be within a predetermined range, the effects ofthe present invention may be obtained.

Hereinafter, each of the components contained in the chemical liquidwill be specifically described.

[Organic Solvent]

The chemical liquid contains an organic solvent.

As the organic solvent, known organic solvents can be used withoutparticular limitation.

The content of the organic solvent in the chemical liquid is notparticularly limited. However, it is preferable that the chemical liquidcontains the organic solvent as a main component. Specifically, thecontent of the organic solvent with respect to the total mass of thechemical liquid is preferably equal to or greater than 98% by mass, morepreferably equal to or greater than 99% by mass, even more preferablyequal to or greater than 99.5% by mass, and particularly preferablyequal to or greater than 99.8% by mass. The upper limit thereof is notparticularly limited, but is preferably equal to or smaller than 99.99%by mass in general. One kind of organic solvent may be used singly, ortwo or more kinds of organic solvents may be used in combination. In acase where two or more kinds of organic solvents are used incombination, the total content thereof is preferably within the aboverange.

The content of the organic solvent in the chemical liquid can bemeasured using gas chromatography mass spectrometry (GCMS). Themeasurement conditions and the like are as described in Examples whichwill be described later.

The boiling point of the organic solvent is not particularly limited.However, in view of obtaining a chemical liquid having further improvedeffects of the present invention, the boiling point of the organicsolvent is preferably lower than 200° C.

In the present specification, the boiling point means a boiling point at1 atm.

The organic solvent is not particularly limited, and examples thereofinclude methanol, ethanol, 1-propanol, isopropanol, n-propanol,2-methyl-1-propanol, n-butanol, 2-butanol, tert-butanol, 1-pentanol,2-pentanol, 3-pentanol, n-hexanol, cyclohexanol, 2-methyl-2-butanol,3-methyl-2-butanol, 2-methyl-1-butanol, 3-methyl-1-butanol,2-methyl-1-pentanol, 2-methyl-2-pentanol, 2-methyl-3-pentanol,3-methyl-1-pentanol, 3-methyl-2-pentanol, 3-methyl-3-pentanol,4-methyl-1-pentanol, 4-methyl-2-pentanol, 2-ethyl-1-butanol,2,2-dimethyl-3-pentanol, 2,3-dimethyl-3-pentanol,2,4-dimethyl-3-pentanol, 4,4-dimethyl-2-pentanol, 3-ethyl-3-pentanol,1-heptanol, 2-heptanol, 3-heptanol, 2-methyl-2-hexanol,2-methyl-3-hexanol, 5-methyl-1-hexanol, 5-methyl-2-hexanol,2-ethyl-1-hexanol, methyl cyclohexanol, trimethyl cyclohexanol,4-methyl-3-heptanol, 6-methyl-2-heptanol, 1-octanol, 2-octanol,3-octanol, 2-propyl-1-pentanol, 2,6-dimethyl-4-heptanol, 2-nonanol,3,7-dimethyl-3-octanol, ethylene glycol, propylene glycol, diethylether, dipropyl ether, diisopropyl ether, butyl methyl ether, butylethyl ether, butyl propyl ether, dibutyl ether, diisobutyl ether,tert-butyl methyl ether, tert-butyl ethyl ether, tert-butyl propylether, di-tert-butyl ether, dipentyl ether, diisoamyl ether, cyclopentylmethyl ether, cyclohexyl methyl ether, bromomethyl methyl ether,α,α-dichloromethyl methyl ether, chloromethyl ethyl ether, 2-chloroethylmethyl ether, 2-bromoethyl methyl ether, 2,2-dichloroethyl methyl ether,2-chloroethyl ethyl ether, 2-bromoethyl ethyl ether,(±)-1,2-dichloroethyl ethyl ether, 2,2,2-trifluoroethyl ether, ethylvinyl ether, butyl vinyl ether, allyl ethyl ether, allyl propyl ether,allyl butyl ether, diallyl ether, 2-methoxypropene,ethyl-1-propenylether, cis-1-bromo-2-ethoxyethylene, 2-chloroethyl vinylether, allyl-1,1,2,2-tetrafluoroethyl ether, octane, isooctane, nonane,decane, methyl cyclohexane, decalin, xylene, ethyl benzene, diethylbenzene, cumene, sec-butyl benzene, cymene, dipentene, methyl pyruvate,propylene glycol monomethyl ether, propylene glycol monoethyl ether,propylene glycol monopropyl ether, propylene glycol monomethyl etheracetate, ethyl lactate, methyl methoxypropionate, cyclopentanone,cyclohexanone, butyl acetate, isoamyl acetate, amyl aceate, n-amylacetate, chloroform, dichloromethane, 1,4-dioxane, hexyl alcohol,γ-butyrolactone, 2-heptanone, 2-hydroxymethyl butyrate, cyclohexanonedimethyl acetal, tetrahydrofuran, and the like.

Among these, in view of obtaining a chemical liquid having furtherimproved effects of the present invention, as the organic solvent, atleast one kind of compound is more preferable which is selected from thegroup consisting of propylene glycol monomethyl ether, propylene glycolmonoethyl ether, propylene glycol monopropyl ether, propylene glycolmonomethyl ether acetate, ethyl lactate, methyl methoxypropionate, hexylalcohol, 2-heptanone, isoamyl acetate, cyclopentanone, cyclohexanone,γ-butyrolactone, diisoamyl ether, butyl acetate, 2-hydroxymethylbutyrate, cyclohexanone dimethyl acetal, and 4-methyl-2-pentanol.

In a case where the chemical liquid contains two or more kinds oforganic solvents, the combination of the organic solvents contained inthe chemical liquid is not particularly limited. In a case where thechemical liquid contains two or more kinds of organic solvents, in viewof obtaining a chemical liquid having further improved effects of thepresent invention, it is preferable that the organic solvents havedifferent boiling points, different solubility parameters, and/ordifferent dielectric constants.

For example, a chemical liquid containing two or more kinds of organicsolvents having different dielectric constants has further improveddefect inhibition performance, although the reason is unclear.Presumably, this is because the occurrence of a defect by staticelectricity may be further inhibited. For example, butyl acetate andisoamyl acetate may be used by being mixed together in any mass.

In a case where the chemical liquid contains two or more kinds oforganic solvents, it is preferable that the chemical liquid contains twoor more kinds of ethers as the organic solvents. The chemical liquidcontaining two or more kinds of ethers (corresponding to organicsolvents) has further improved defect inhibition performance.

As the ethers, known ethers can be used without particular limitation.As the two or more kinds of ethers, for example, two or more kinds ofethers are preferable which are selected from the group consisting ofpropylene glycol monomethyl ether acetate, propylene glycol monomethylether, diethylene glycol monomethyl ether, diethylene glycol monoethylether, and diethylene glycol monobutyl ether.

It is preferable that the organic solvents contain propylene glycolmonomethyl ether acetate and propylene glycol monomethyl ether among theabove.

In a case where the chemical liquid contains two or more kinds oforganic solvents, the mass ratio of the organic solvents in the chemicalliquid is not particularly limited but is preferably 1/99 to 99/1 ingeneral, more preferably 10/90 to 90/10, and even more preferably 20/80to 60/40.

In a case where the chemical liquid contains three or more kinds oforganic solvents, the combination of the three or more kinds of organicsolvents is not particularly limited, but the following combinations oforganic solvents and the like are preferable.

Propylene glycol monomethyl ether acetate (PGMEA)/propylene glycolmonomethyl ether (PGME)/γ-butyrolactone

-   -   PGMEA/PGME/cyclohexanone    -   PGMEA/PGME/2-heptanone    -   PGMEA/cyclohexanone/γ-butyrolactone    -   PGMEA/γ-butyrolactone/2-heptanone

[Organic Impurity]

The chemical liquid contains an organic impurity.

In the present specification, the organic impurity means an organicsubstance as a compound which is different from the organic solventcontained in the chemical liquid as a main component and is contained inthe chemical liquid in an amount equal to or smaller than 10,000 massppm with respect to the total mass of the chemical liquid. That is, inthe present specification, an organic substance which is contained inthe chemical liquid in an amount equal to or smaller than 10,000 massppm with respect to the total mass of the chemical liquid corresponds toan organic impurity but does not correspond to an organic solvent.

In a case where the chemical liquid contains an organic impurity formedof a plurality of kinds of compounds, as long as each of the compoundscorresponds to the aforementioned organic substance which is containedin the chemical liquid in an amount equal to or smaller than 10,000 massppm, each of the compounds corresponds to the organic impurity.

The organic impurity may be added to the chemical liquid or may beunintentionally mixed into the chemical liquid in the manufacturingprocess of the chemical liquid. Examples of the case where the organicimpurity is unintentionally mixed into the chemical liquid in themanufacturing process of the chemical liquid include a case where theorganic impurity is contained in a raw material (for example, an organicsolvent) used for manufacturing the chemical liquid, a case where theorganic impurity is mixed into the chemical liquid in the manufacturingprocess of the chemical liquid (for example, contamination), and thelike. However, the present invention is not limited to these

The total content of the organic impurity in the chemical liquid withrespect to the total mass of the chemical liquid is 0.1 to 10,000 massppm, more preferably 0.1 to 8,000 mass ppm, and even more preferably 0.1to 3,000 mass ppm. In a case where the total content of the organicimpurity is 0.1 to 8,000 mass ppm, the chemical liquid has furtherimproved defect inhibition performance.

One kind of organic impurity may be used singly, or two or more kinds oforganic impurities may be used in combination. In a case where two ormore kinds of organic impurities are used in combination, the totalcontent thereof is preferably within the above range.

The total content of the organic impurity in the chemical liquid can bemeasured using gas chromatography mass spectrometry (GCMS). Themeasurement conditions and the like are as described in Examples.

The mass ratio of the content of the alcohol impurity, which will bedescribed later, to the total content of the organic impurity (contentof alcohol impurity/total content of organic impurity) is 0.0001 to 0.5,and preferably 0.0001 to 0.1. In a case where the mass ratio is within arange of 0.0001 to 0.5, the chemical liquid has further improveddevelopability.

Examples of the organic impurity include antioxidants such asdibutylhydroxytoluene (BHT), distearylthiodipropionate (DSTP),4,4′-butylidenebis-(6-t-butyl-3-methylphenol),2,2′-methylenebis-(4-ethyl-6-t-butylphenol), and the antioxidantsdescribed in JP2015-200775A; unreacted raw materials; structural isomersand byproducts produced at the time of manufacturing the organicsolvent; substances eluted from members constituting an organic solventmanufacturing device and the like (for example, a plasticizer elutedfrom a rubber member such as an O-ring); and the like.

Examples of the organic impurity include byproducts generated at thetime of synthesizing the organic solvent and/or unreacted raw materials(hereinafter, referred to as “byproduct and the like” as well), and thelike. For example, in a case where the organic solvent is an alcoholcompound, a ketone compound, an ester compound, an ether compound, andan aldehyde compound, examples of the byproduct and the like include analcohol compound, a ketone compound, an ester compound, an ethercompound, an aldehyde compound, and the like.

Examples of the byproduct and the like include compounds represented byFormulae I to V, and the like.

In Formula I, R₁ and R₂ each independently represent an alkyl group or acycloalkyl group. Alternatively, R₁ and R₂ form a ring by being bondedto each other.

As the alkyl group or the cycloalkyl group represented by R₁ and R₂, analkyl group having 1 to 12 carbon atoms or a cycloalkyl group having 6to 12 carbon atoms is preferable, and an alkyl group having 1 to 8carbon atoms or a cycloalkyl group having 6 to 8 carbon atoms is morepreferable.

The ring formed of R₁ and R₂ bonded to each other is a lactone ring,preferably a 4- to 9-membered lactone ring, and more preferably a 4- to6-membered lactone ring.

It is preferable that R₁ and R₂ satisfy a relationship in which thenumber of carbon atoms in the compound represented by Formula I becomesequal to or greater than 6.

In Formula II, R₃ and R₄ each independently represent a hydrogen atom,an alkyl group, an alkenyl group, a cycloalkyl group, or a cycloalkenylgroup. Alternatively, R₃ and R₄ form a ring by being bonded to eachother. Here, R₃ and R₄ do not simultaneously represent a hydrogen atom.

As the alkyl group represented by R₃ and R₄, for example, an alkyl grouphaving 1 to 12 carbon atoms is preferable, and an alkyl group having 1to 8 carbon atoms is more preferable.

As the alkenyl group represented by R₃ and R₄, for example, an alkenylgroup having 2 to 12 carbon atoms is preferable, and an alkenyl grouphaving 2 to 8 carbon atoms is more preferable.

As the cycloalkyl group represented by R₃ and R₄, for example, acycloalkyl group having 6 to 12 carbon atoms is preferable, and acycloalkyl group having 6 to 8 carbon atoms is more preferable.

As the cycloalkenyl group represented by R₃ and R₄, for example, acycloalkenyl group having 3 to 12 carbon atoms is preferable, and acycloalkenyl group having 6 to 8 carbon atoms is more preferable.

The ring formed of R₃ and R₄ bonded to each other is a cyclic ketonestructure which may be a saturated cyclic ketone or an unsaturatedcyclic ketone. The cyclic ketone is preferably a 6- to 10-membered ring,and more preferably a 6- to 8-membered ring.

It is preferable that R₃ and R₄ satisfy a relationship in which thenumber of carbon atoms in the compound represented by Formula II becomesequal to or greater than 6.

In Formula III, R₅ represents an alkyl group or a cycloalkyl group.

As the alkyl group represented by R₅, an alkyl group having 6 or morecarbon atoms is preferable, an alkyl group having 6 to 12 carbon atomsis more preferable, and an alkyl group having 6 to 10 carbon atoms iseven more preferable

The alkyl group may have an ether bond in the chain thereof or may havea substituent such as a hydroxy group.

As the cycloalkyl group represented by R₅, a cycloalkyl group having 6or more carbon atoms is preferable, a cycloalkyl group having 6 to 12carbon atoms is more preferable, and a cycloalkyl group having 6 to 10carbon atoms is even more preferable.

In Formula IV, R₆ and R₇ each independently represent an alkyl group ora cycloalkyl group. Alternatively, R₆ and R₇ form a ring by being bondedto each other.

As the alkyl group represented by R₆ and R₇, an alkyl group having 1 to12 carbon atoms is preferable, and an alkyl group having 1 to 8 carbonatoms is more preferable.

As the cycloalkyl group represented by R₆ and R₇, a cycloalkyl grouphaving 6 to 12 carbon atoms is preferable, and a cycloalkyl group having6 to 8 carbon atoms is more preferable.

The ring formed of R₆ and R₇ bonded to each other is a cyclic etherstructure. The cyclic ether structure is preferably a 4- to 8-memberedring, and more preferably a 5- to 7-membered ring.

It is preferable that R₆ and R₇ satisfy a relationship in which thenumber of carbon atoms in the compound represented by Formula IV becomesequal to or greater than 6.

In Formula V, R₈ and R₉ each independently represent an alkyl group or acycloalkyl group. Alternatively, R₈ and R₉ form a ring by being bondedto each other. L represents a single bond or an alkylene group.

As the alkyl group represented by R₈ and R₉, an alkyl group having 6 to12 carbon atoms is preferable, and an alkyl group having 6 to 10 carbonatoms is more preferable.

As the cycloalkyl group represented by R₈ and R₉, a cycloalkyl grouphaving 6 to 12 carbon atoms is preferable, and a cycloalkyl group having6 to 10 carbon atoms is more preferable.

The ring formed of R₈ and R₉ bonded to each other is a cyclic diketonestructure. The cyclic diketone structure is preferably a 6- to12-membered ring, and more preferably a 6- to 10-membered ring.

As the alkylene group represented by L, for example, an alkylene grouphaving 1 to 12 carbon atoms is preferable, and an alkylene group having1 to 10 carbon atoms is more preferable.

R₈, R₉, and L satisfy a relationship in which the number of carbon atomsin the compound represented by Formula V becomes equal to or greaterthan 6.

The organic impurity is not particularly limited. However, in a casewhere the organic solvents are an amide compound, an imide compound, anda sulfoxide compound, in an aspect, examples of the organic impurityinclude an amide compound, an imide compound, and a sulfoxide compoundhaving 6 or more carbon atoms. Examples thereof include the followingcompounds.

<Alcohol Impurity>

The organic impurity contains an alcohol impurity.

As the alcohol impurity, an alcohol impurity containing one or morealcoholic hydroxyl groups in one molecule can be used without particularlimitation.

In the present specification, the alcohol impurity is an organicimpurity containing one or more alcoholic hydroxyl groups.

The alcohol impurity may be added to the chemical liquid orunintentionally mixed into the chemical liquid in the manufacturingprocess of the chemical liquid. Examples of the case where the alcoholimpurity is unintentionally mixed into the chemical liquid in themanufacturing process of the chemical liquid include a case where thealcohol impurity is contained in a raw material (for example, an organicsolvent) used for manufacturing the chemical liquid, a case where thealcohol impurity is mixed into the chemical liquid in the manufacturingprocess of the chemical liquid (for example, contamination), and thelike. However, the present invention is not limited to these.

The content of the alcohol impurity in the chemical liquid with respectto the total mass of the chemical liquid is preferably 0.05 to 5,000mass ppm, and more preferably 0.1 to 3,000 mass ppm.

One kind of alcohol impurity may be used singly, or two or more kinds ofalcohol impurities may be used in combination. In a case where two ormore kinds of alcohol impurities are used in combination, the totalcontent thereof is preferably within the above range.

The alcohol impurity is not particularly limited, and examples thereofinclude linear, branched, and cyclic alcohols. Examples of monohydricalcohol impurities include methanol, ethanol, propanol, isopropanol,1-butanol, 2-butanol, 3-methyl-1-butanol, tert-butyl alcohol,1-pentanol, 2-pentanol, 1-hexanol, 4-methyl-2-pentanol, 1-heptanol,1-octanol, 2-hexanol, cyclopentanol, 2-heptanol, 2-octanol, 3-hexanol,3-heptanol, 3-octanol, 4-octanol, and the like. Examples of alcoholimpurities having two or more hydroxyl groups include alkylene glycol,glycerin, and the like.

[Metal Impurity]

The chemical liquid contains a metal impurity. The metal impuritycontains metal atoms. The form of the metal impurity is not particularlylimited. In the present specification, the metal impurity containingmetal atoms means a metal impurity contained in the chemical liquid inthe form of a metal ion or a solid (particle-like metal-containingcompound or the like).

In the present specification, the total content of the metal atomscontained in the metal impurity in the chemical liquid means the contentof the metal atoms measured by inductively coupled plasma massspectrometry (ICP-MS). The method for measuring the content of the metalatoms by using ICP-MS is as described in Examples which will bedescribed later.

In the chemical liquid, the total content of the metal atoms containedin the metal impurity with respect to the total mass of the chemicalliquid is equal to or smaller than 50 mass ppt, and preferably equal toor smaller than 30 mass ppt. The lower limit of the total content of themetal atoms is not particularly limited, but is preferably equal to orgreater than 0.05 mass ppt in general.

One kind of metal impurity may be used singly, or two or more kinds ofmetal impurities may be used in combination. In a case where two or morekinds of metal impurities are used in combination, the total content ofthe metal atoms is preferably within the above range.

The metal impurity may be added to the chemical liquid or may beunintentionally mixed into the chemical liquid in the manufacturingprocess of the chemical liquid. Examples of the case where the metalimpurity is unintentionally mixed into the chemical liquid in themanufacturing process of the chemical liquid include a case where themetal impurity is contained in a raw material (for example, an organicsolvent) used for manufacturing the chemical liquid, a case where themetal impurity is mixed into the chemical liquid in the manufacturingprocess of the chemical liquid (for example, contamination), and thelike. However, the present invention is not limited to these.

Particularly, in view of obtaining a chemical liquid having furtherimproved effects of the present invention, the metal impurity morepreferably contains a Fe atom, a Ni atom, a Cr atom, and a Pb atom, andthe mass ratio of the content of each of the above atoms to the totalcontent of the metal atoms contained in the metal impurity in thechemical liquid is more preferably within the following range. In a casewhere the mass ratio of the content of each atom is within the followingrange, the chemical liquid has further improved defect inhibitionperformance.

-   -   Fe atom: 0.01 to 0.5    -   Cr atom: 0.01 to 0.5    -   Ni atom: 0.01 to 0.5    -   Pb atom: 0.005 to 0.3

Particularly, in view of obtaining a chemical liquid having furtherimproved effects of the present invention, the mass ratio of the contentof each atom to the total content of the metal atoms is even morepreferably within the following range.

-   -   Fe atom: 0.01 to 0.3    -   Cr atom: 0.01 to 0.3    -   Ni atom: 0.01 to 0.3    -   Pb atom: 0.01 to 0.15

[Optional Component]

As long as the effects of the present invention are exhibited, thechemical liquid may contain other components in addition to thecomponents described above. Examples of other components include water.

[Water]

The chemical liquid may contain water. As the water, for example,distilled water, deionized water, pure water, and the like can be usedwithout particular limitation.

Water may be added to the chemical liquid or may be unintentionallymixed into the chemical liquid in the manufacturing process of thechemical liquid. Examples of the case where water is unintentionallymixed into the chemical liquid in the manufacturing process of thechemical liquid include a case where water is contained in a rawmaterial (for example, an organic solvent) used for manufacturing thechemical liquid, a case where water is mixed into the chemical liquid inthe manufacturing process of the chemical liquid (for example,contamination), and the like. However, the present invention is notlimited to these.

The content of water in the chemical liquid is not particularly limited.Generally, the content of water with respect to the total mass of thechemical liquid is preferably 0.05% to 2.0% by mass, and more preferably0.1% to 1.5% by mass.

In a case where the content of water in the chemical liquid is 0.1% to1.5% by mass, the chemical liquid has further improved defect inhibitionperformance.

In a case where the content of water is equal to or greater than 0.1% bymass, the metal component is not easily eluted. In a case where thecontent of water is equal to or smaller than 1.5% by mass, water isinhibited from becoming the cause of a defect.

In the present specification, the content of water means a moisturecontent measured using a device which adopts the Karl Fischer moisturemeasurement method as the principle of measurement. The measurementmethod performed by the device is as described in Examples which will bedescribed later.

[Physical Properties of Chemical Liquid]

It is preferable that the chemical liquid has the following physicalproperties, because then the chemical liquid has further improvedeffects of the present invention.

(1) The mass ratio of the total content of a component having a boilingpoint equal to or higher than 250° C. to the total content of acomponent having a boiling point lower than 250° C. is 0.000001 to0.001.

(2) The number of objects to be counted having a size of equal to orgreater than 0.1 μm that are counted by a light scattering-typeliquid-borne particle counter is equal to or smaller than 100/mL.

Hereinafter, the physical properties (1) and (2) of the chemical liquidwill be described.

<Physical property 1: mass ratio of total content of component havingboiling point equal to or higher than 250° C. to total content ofcomponent having boiling point lower than 250° C. is 0.00001 to 0.001>

The mass ratio (high-boiling-point compound/low-boiling-point compound)of the total content of the component (high-boiling-point compound),which is contained in the chemical liquid and has a boiling point(boiling point at 1 atm, the same is true for the following description)equal to or higher than 250° C., to the total content of the component(low-boiling-point compound), which is contained in the chemical liquidand has a boiling point lower than 250° C., is not particularly limited.However, in view of obtaining a chemical liquid having further improvedeffects of the present invention, the mass ratio is preferably 0.000005to 0.005, more preferably 0.00001 to 0.001, and even more preferably0.00001 to 0.0001.

In a case where the mass ratio is within a range of 0.00001 to 0.001,the chemical liquid has further improved defect inhibition performance.

In a case where the mass ratio is equal to or greater than 0.00001, thechemical liquid has further improved temporal stability, although thereason is unclear. The inventors of the present invention assume thatthis is because the high-boiling-point compound may act as anantioxidant in the chemical liquid. In the present specification, thetemporal stability of the chemical liquid means the temporal stabilityof the chemical liquid measured by the method described in Examples.

Examples of the high-boiling-point compound in the chemical liquidinclude a component such an organic impurity or an organic solventhaving a boiling point equal to or higher than 250° C., and the like.

Examples of the component include dioctyl phthalate (boiling point: 385°C.), diisononyl phthalate (boiling point: 403° C.), dioctyl adipate(boiling point: 335° C.), dibutyl phthalate (boiling point: 340° C.),ethylene propylene rubber (boiling point: 300° C. to 450° C.), and thelike, but the present invention is not limited to these.

Examples of the low-boiling-point compound in the chemical liquidinclude an organic impurity having a boiling point lower than 200° C.,an organic solvent, and the like.

The aforementioned mass ratio can be determined by quantifying each ofthe components in the chemical liquid by using the method describedabove, classifying the quantified components into a high-boiling-pointcompound and a low-boiling-point compound according to the boiling pointthereof, and calculating the mass ratio from the total content of thecompounds.

<Physical property 2: number of objects to be counted having size equalto or greater than 0.1 μm that are counted by light scattering-typeliquid-borne particle counter is equal to or smaller than 100/mL>

In view of making the chemical liquid have further improved effects ofthe present invention, the number of objects to be counted having a sizeequal to or greater than 0.1 μm that are counted by a lightscattering-type liquid-borne particle counter is preferably equal to orsmaller than 100/mL.

In the present specification, the objects to be counted having a sizeequal to or greater than 0.1 μm that are counted by a lightscattering-type liquid-borne particle counter are referred to as “coarseparticles” as well.

Examples of the coarse particles include particles (particles of dirt,dust, organic solids, inorganic solids, and the like) contained in a rawmaterial (for example, an organic solvent) used for manufacturing thechemical liquid, particles (dirt, dust, solids (formed of organicsubstances, inorganic substances, and/or metals)) incorporated ascontaminants into the chemical liquid while the chemical liquid is beingprepared, and the like. However, the present invention is not limited tothese.

The coarse particles also include a collodized impurity containing metalatoms. The metal atoms are not particularly limited. However, in a casewhere the content of at least one kind of metal atom selected from thegroup consisting of Na, K, Ca, Fe, Cu, Mg, Mn, Li, Al, Cr, Ni, Zn, andPb (preferably Fe, Cr, Ni, and Pb) is particularly small (for example,in a case where the content of each of the aforementioned metal atoms inthe organic solvent is equal to or smaller than 1,000 mass ppt), theimpurity containing these metal atoms is easily colloidized.

[Manufacturing Method of Chemical Liquid]

As the manufacturing method of the chemical liquid, known manufacturingmethods can be used without particular limitation. Particularly, in viewof more simply obtaining the chemical liquid, a manufacturing method ofa chemical liquid having the following step (2) is preferable, and amanufacturing method of a chemical liquid having the following steps inthe following order is more preferable. Hereinafter, each of the stepswill be specifically described.

(1) Preparation step of preparing substance to be purified containingorganic solvent

(2) Purification step of purifying substance to be purified so as toobtain chemical liquid

<(1) Preparation Step>

The preparation step is a step of preparing a substance to be purifiedcontaining an organic solvent. The method for preparing the substance tobe purified is not particularly limited, and examples thereof includemethods such as preparing the substance to be purified containing anorganic solvent by purchase and obtaining the substance to be purifiedcontaining an organic solvent by reacting raw materials (the organicsolvent is a reaction product). As the substance to be purified, it ispreferable to prepare a substance in which the content of theaforementioned metal impurity containing metal atoms and/or theaforementioned organic impurity is small (for example, a substance inwhich the content of an organic solvent is equal to or greater than 99%by mass). Examples of commercial products of the substance to bepurified containing an organic solvent include those called “high-puritygrade products” of “organic solvents”.

As the method for obtaining the organic solvent as a reaction product byreacting raw materials, known methods can be used without particularlimitation. Examples thereof include a method for obtaining an organicsolvent as a reaction product by reacting a single raw material or aplurality of raw materials in the presence of a catalyst.

More specifically, examples of the method include a method for obtainingbutyl acetate by reacting acetic acid and n-butanol in the presence ofsulfuric acid; a method for obtaining 1-hexanol by reacting ethylene,oxygen, and water in the presence of Al(C₂H₅)₃; a method for obtaining4-methyl-2-pentanol by reacting cis-4-methyl-2-pentene in the presenceof Diisopinocampheylborane (Ipc2BH); a method for obtaining propyleneglycol 1-monomethyl ether 2-acetate (PGMEA) by reacting propylene oxide,methanol, and acetic acid in the presence of sulfuric acid; a method forobtaining isopropyl alcohol (IPA) by reacting acetone and hydrogen inthe presence of copper oxide-zinc oxide-aluminum oxide; a method forobtaining ethyl lactate by reacting lactic acid and ethanol; and thelike.

<(2) Purification Step>

The purification step is a step of purifying the substance to bepurified so as to obtain a chemical liquid having desired physicalproperties.

As the purification method of the substance to be purified, knownmethods can be used without particular limitation. It is preferable thatthe purification method of the substance to be purified includes atleast one kind of step selected from the group consisting of the stepsdescribed below. Hereinafter, each of the steps will be specificallydescribed.

In the purification step, each of the following steps may be performedonce or plural times. Furthermore, the order of the following steps isnot particularly limited.

-   -   Distillation Step    -   Component Adjustment Step

(Distillation Step)

It is preferable that (2) purification step includes a distillationstep. The distillation step means a step of distilling the substance tobe purified so as to obtain a substance to be purified or a chemicalliquid having undergone purification (hereinafter, referred to as“purified substance” as well). As the distillation method, known methodscan be used without particular limitation.

Particularly, in view of more simply obtaining a purified substance andmaking it more difficult for impurities to be unintentionally mixed intothe purified substance in the distillation step, it is preferable todistill the substance to be purified by using the following purificationdevice.

Purification Device

As an aspect of the purification device which can be used in thedistillation step, for example, a purification device can be exemplifiedwhich has a distillation column for distilling the substance to bepurified containing an organic solvent, in which a liquid contactportion of the distillation column is formed of at least one kind ofmaterial selected from the group consisting of a nonmetallic materialand an electropolished metallic material.

In the present specification, the liquid contact portion means a portionwhich is likely to contact at least either the substance to be purifiedor the chemical liquid in the purification device and the like. Theliquid contact portion is not limited, but means, for example, theinterior wall, the pipe line, and the like of the purification device.

As the nonmetallic material, known materials can be used withoutparticular limitation.

Examples of the nonmetallic material include at least one kind ofmaterial selected from the group consisting of a polyethylene resin, apolypropylene resin, a polyethylene-polypropylene resin,polytetrafluoroethylene, a tetrafluoroethylene-perfluoroalkyl vinylether copolymer, a tetrafluoroethylene-hexafluoropropylene copolymerresin, a tetrafluoroethylene-ethylene copolymer resin, a chlorotrifluoroethylene-ethylene copolymer resin, a vinylidene fluoride resin, achlorotrifluoroethylene copolymer resin, and a vinyl fluoride resin.However, the present invention is not limited to these.

As the metallic material, known materials can be used without particularlimitation.

Examples of the metallic material include a metallic material in whichthe total content of chromium and nickel with respect to the total massof the metallic material is greater than 25% by mass. The total contentof chromium and nickel is more preferably equal to or greater than 30%by mass. The upper limit of the total content of chromium and nickel inthe metallic material is not particularly limited, but is preferablyequal to or smaller than 90% by mass in general.

Examples of the metallic material include stainless steel, anickel-chromium alloy, and the like.

As the stainless steel, known stainless steel can be used withoutparticular limitation. Among these, an alloy with a nickel content equalto or higher than 8% by mass is preferable, and austenite-basedstainless steel with a nickel content equal to or higher than 8% by massis more preferable. Examples of the austenite-based stainless steelinclude Steel Use Stainless (SUS) 304 (Ni content: 8% by mass, Crcontent: 18% by mass), SUS304L (Ni content: 9% by mass, Cr content: 18%by mass), SUS316 (Ni content: 10% by mass, Cr content: 16% by mass),SUS316L (Ni content: 12% by mass, Cr content: 16% by mass), and thelike.

As the nickel-chromium alloy, known nickel-chromium alloys can be usedwithout particular limitation. Among these, a nickel-chromium alloy ispreferable in which the nickel content is 40% to 75% by mass and thechromium content is 1% to 30% by mass with respect to the total mass ofthe metallic material.

Examples of the nickel-chromium alloy include HASTELLOY (tradename, thesame is true for the following description), MONEL (tradename, the sameis true for the following description), INCONEL (tradename, the same istrue for the following description), and the like. More specifically,examples thereof include HASTELLOY C-276 (Ni content: 63% by mass, Crcontent: 16% by mass), HASTELLOY C (Ni content: 60% by mass, Cr content:17% by mass), HASTELLOY C-22 (Ni content: 61% by mass, Cr content: 22%by mass), and the like.

Furthermore, if necessary, the nickel-chromium alloy may further containboron, silicon, tungsten, molybdenum, copper, cobalt, and the like inaddition to the aforementioned alloy.

As the method for electropolishing the metallic material, known methodscan be used without particular limitation. For example, it is possibleto use the methods described in paragraphs [0011] to [0014] inJP2015-227501A, paragraphs [0036] to [0042] in JP2008-264929A, and thelike.

Presumably, in a case where the metallic material is electropolished,the chromium content in a passive layer on the surface thereof maybecome higher than the chromium content in the parent phase. For thisreason, from the distillation column in which the liquid contact portionis formed of an electropolished metallic material, the metal impuritycontaining metal atoms may not easily flow into the substance to bepurified and the purified substance, and hence a purified substance witha reduced impurity content can be obtained.

The metallic material may have undergone buffing. As the buffing method,known methods can be used without particular limitation. The size ofabrasive grains used for finishing the buffing is not particularlylimited, but is preferably equal to or smaller than #400 because suchgrains make it easy to further reduce the surface asperity of themetallic material. The buffing is preferably performed before theelectropolishing.

Purification Device (Another Aspect)

As another aspect of the purification device which can be used in thedistillation step, a purification device can be exemplified whichcomprises a reaction portion for obtaining an organic solvent, which isa reaction product, by reacting raw materials, the distillation columndescribed above, and a transfer pipe line which connects the reactionportion and the distillation column to each other so as to transfer thereactant to the distillation column from the reaction portion.

The reaction portion has a function of obtaining an organic solvent,which is a reactant, by reacting the supplied raw materials (ifnecessary, in the presence of a catalyst). As the reaction portion,known reaction portions can be used without particular limitation.

Examples of the reaction portion include an aspect including a reactorto which raw materials are supplied and in which a reaction proceeds, astirring portion provided in the interior of the reactor, a lid portionjoined to the reactor, an injection portion for injecting the rawmaterials into the reactor, and a reactant outlet portion for taking thereactant out of the reactor. By continuously or non-continuouslyinjecting the raw materials into the reaction portion and reacting theinjected raw materials (in the presence of a catalyst), an organicsolvent which is a reaction product can be obtained.

If desired, the reaction portion may also include a reactant isolationportion, a temperature adjustment portion, a sensor portion including alevel gauge, a manometer, and a thermometer, and the like.

It is preferable that the liquid contact portion (for example, theinterior wall of the liquid contact portion of the reactor, or the like)of the reaction portion is formed of at least one kind of materialselected from the group consisting of a nonmetallic material and anelectropolished metallic material. The aspect of each of theaforementioned materials is as described above.

In a case where the purification device including the reaction portionis used, a purified substance with a further reduced impurity content isobtained.

In the purification device according to the above aspect, the reactionportion and the distillation column are connected to each other throughthe transfer pipe line. Because the reaction portion and thedistillation column are connected to each other through the transferpipe line, the transfer of the substance to be purified to thedistillation column from the reaction portion is carried out in a closedsystem, and impurities including a metal impurity are inhibited frombeing mixed into the substance to be purified from the environment.Accordingly, a purified substance with a further reduced impuritycontent can be obtained.

As the transfer pipe line, known transfer pipe lines can be used withoutparticular limitation. As the transfer pipe line, an aspect comprising apipe, a pump, a valve, and the like can be exemplified.

It is preferable that the liquid contact portion of the transfer pipeline is formed of at least one kind of material selected from the groupconsisting of a nonmetallic material and an electropolished metallicmaterial. The aspect of each of the aforementioned materials is asdescribed above.

In a case where the purification device comprising the transfer pipeline is used, it is possible to more simply obtain a purified substancewith a further reduced impurity content.

(Component Adjustment Step)

It is preferable that (2) purification step described above includes acomponent adjustment step.

The component adjustment step is a step of adjusting the content of themetal impurity, the organic impurity, water, and the like contained inthe substance to be purified.

As the method for adjusting the content of the metal impurity, theorganic impurity, water, and the like contained in the substance to bepurified, known methods can be used without particular limitation.

Examples of the method for adjusting the content of the metal impurity,the organic impurity, water, and the like contained in the substance tobe purified include a method for adding a metal impurity, an organicimpurity, water, and the like in a predetermined amount to the substanceto be purified, a method for removing a metal impurity, an organicimpurity, water, and the like from the substance to be purified, and thelike.

As the method for removing a metal impurity, an organic impurity, andwater, and the like from the substance to be purified, known methods canbe used without particular limitation.

As the method for removing a metal impurity, an organic impurity, water,and the lie from the substance to be purified, for example, a method forfiltering the substance to be purified through a filter (hereinafter, astep of performing the filtering will be referred to as “filteringstep”) is preferable. The method for filtering the substance to bepurified through a filter is not particularly limited, and examplesthereof include a method for disposing a filter unit comprising a filterand a filter housing in the middle of a transfer pipe line transferringthe substance to be purified and passing the substance to be purifiedthrough the filter unit with or without applying pressure thereto.

As the filter, known filters can be used without particular limitation.

Filtering Step

It is preferable that the component adjustment step includes a filteringstep.

As the filter used in the filtering step, known filters can be usedwithout particular limitation.

Examples of the material of the filter used in the filtering stepinclude a fluororesin such as polytetrafluoroethylene (PTFE), apolyamide-based resin such as nylon, a polyolefin resin (including apolyolefin resin with high density and ultra-high molecular weight) suchas polyethylene and polypropylene (PP), and the like. Among these, apolyamide-based resin, PTFE, and polypropylene (including high-densitypolypropylene) are preferable. In a case where filters formed of thesematerials are used, foreign substances with high polarity, which readilybecome the cause of a particle defect, can be efficiently removed, andthe amount of the metal component (metal impurity) can be efficientlyreduced.

The lower limit of the critical surface tension of the filter ispreferably equal to or higher than 70 mN/m. The upper limit thereof ispreferably equal to or lower than 95 mN/m. The critical surface tensionof the filter is more preferably equal to or higher than 75 mN/m andequal to or lower than 85 mN/m.

The value of the critical surface tension is the nominal value frommanufacturers. In a case where a filter having critical surface tensionwithin the above range is used, foreign substances with high polarity,which readily become the cause of a particle defect, can be effectivelyremoved, and the amount of the metal component (metal impurity) can beefficiently reduced.

The pore size of the filter is preferably about 0.001 to 1.0 μm, morepreferably about 0.01 to 0.5 μm, and even more preferably about 0.01 to0.1 μm. In a case where the pore size of the filter is within the aboverange, it is possible to inhibit the clogging of the filter and toreliably remove minute foreign substances contained in the substance tobe purified.

At the time of using the filter, different filters may be combined. Atthis time, filtering carried out using a first filter may be performedonce or performed two or more times. In a case where filtering isperformed two or more times by using different filters in combination,the filters may be of the same type or different types, but it ispreferable that the filters are of different types. Typically, it ispreferable that at least one of the pore size or the constituentmaterial varies between the first filter and the second filter.

It is preferable that the pore size for the second filtering and thenext filtering is the same as or smaller than the pore size for thefirst filtering. Furthermore, first filters having different pore sizeswithin the above range may be combined. As the pore size mentionedherein, the nominal values form filter manufacturers can be referred to.A commercial filter can be selected from various filters provided from,for example, Pall Corporation Japan, Advantec Toyo Kaisha, Ltd., NihonEntegris KK (former MICRONICS JAPAN CO., LTD.), KITZ MICRO FILTERCORPORATION, or the like. In addition, it is possible to use “P-NYLONFILTER (pore size: 0.02 critical surface tension: 77 mN/m)” made ofpolyamide; (manufactured by Pall Corporation Japan), “PE⋅CLEAN FILTER(pore size: 0.02 μm)” made of high-density polyethylene; (manufacturedby Pall Corporation Japan), and “PE⋅CLEAN FILTER (pore size: 0.01 μm)”made of high-density polyethylene; (manufactured by Pall CorporationJapan).

For example, from the viewpoint of allowing the chemical liquidaccording to the embodiment of the present invention to bring aboutdesired effects and from the viewpoint of inhibiting the increase of themetal impurity (particularly, a metal impurity present in the chemicalliquid as a solid) during the storage of the purified chemical liquid,provided that an interaction radius in the Hansen solubility parameterspace (HSP) derived from the material of the filter used for filteringis R0, and that a radius of a sphere in the Hansen space derived fromthe organic solvent contained in the substance to be purified is Ra, itis preferable that the substance to be purified and the material of thefilter used for filtering are combined such that the substance to bepurified and the filter have a relationship satisfying a relationalexpression of (Ra/R0)≤1, and the substance to be purified is preferablyfiltered through a filter material satisfying the relational expression,although the combination of the substance to be purified and the filteris not particularly limited. Ra/R0 is preferably equal to or smallerthan 0.98, and more preferably equal to or smaller than 0.95. The lowerlimit of Ra/R0 is preferably equal to or greater than 0.5, morepreferably equal to or greater than 0.6, and even more preferably 0.7.In a case where Ra/R0 is within the above range, the increase in thecontent of the metal impurity in the chemical liquid during long-termstorage is inhibited, although the mechanism is unclear.

The combination of the filter and the substance to be purified is notparticularly limited, and examples thereof include those described inUS2016/0089622.

As a second filter, a filter formed of the same material as theaforementioned first filter can be used. Furthermore, a filter havingthe same pore size as the aforementioned first filter can be used. In acase where a filter having a pore size smaller than that of the firstfilter is used as the second filter, a ratio between the pore size ofthe second filter and the pore size of the first filter (pore size ofsecond filter/pore size of first filter) is preferably 0.01 to 0.99,more preferably 0.1 to 0.9, and even more preferably 0.2 to 0.9. In acase where the pore size of the second filter is within the above range,fine foreign substances mixed into the solution are more reliablyremoved.

The filtering pressure affects the filtering accuracy. Therefore, it ispreferable that the pulsation of pressure at the time of filtering is aslow as possible.

In the manufacturing method of a chemical liquid, the filtering speed isnot particularly limited. However, in view of obtaining a chemicalliquid having further improved effects of the present invention, thefiltering speed is preferably equal to or higher than 1.0 L/min/m², morepreferably equal to or higher than 0.75 L/min/m², and even morepreferably equal to or higher than 0.6 L/min/m².

For the filter, an endurable differential pressure for assuring thefilter performance (assuring that the filter will not be broken) is set.In a case where the endurable differential pressure is high, byincreasing the filtering pressure, the filtering speed can be increased.That is, it is preferable that the upper limit of the filtering speed isgenerally equal to or lower than 10.0 L/min/m² although the upper limitusually depends on the endurable differential pressure of the filter.

In the manufacturing method of a chemical liquid, in view of obtaining achemical liquid having further improved effects of the presentinvention, the filtering pressure is preferably 0.001 to 1.0 MPa, morepreferably 0.003 to 0.5 MPa, and even more preferably 0.005 to 0.3 MPa.Particularly, in a case where a filter having a small pore size is used,by increasing the filtering pressure, it is possible to efficientlyreduce the amount of particle-like foreign substances or impuritiesdissolved in the substance to be purified. In a case where a filterhaving a pore size smaller than 20 nm is used, the filtering pressure isparticularly preferably 0.005 to 0.3 MPa.

The smaller the pore size of the filtration filter, the lower thefiltering speed. However, for example, in a case where a plurality offiltration filters of the same type are connected to each other inparallel, the filtering area is enlarged, and the filtering pressure isreduced. Therefore, in this way, the reduction in the filtering speedcan be compensated.

It is more preferable that the filtering step includes the followingsteps. In the filtering step, each of the following steps may beperformed once or plural times. Furthermore, the order of the followingsteps is not particularly limited.

1. Particle removing step

2. Metal ion removing step

3. Organic impurity removing step

4. Ion exchange step

Hereinafter, each of the steps will be described.

Particle Removing Step

The particle removing step is a step of removing the coarse particlesand/or the metal impurity (particularly, the metal impurity present as asolid in the chemical liquid) in the substance to be purified by using aparticle removing filter. As the particle removing filter, knownparticle removing filters can be used without particular limitation.

Examples of the particle removing filter include a filter for removingparticles having a diameter equal to or smaller than 20 nm. In a casewhere the organic solvent is filtered using the above filter, the coarseparticles can be removed from the organic solvent (the aspect of thecoarse particles is as described above).

The diameter of the particles to be removed is preferably 1 to 15 nm,and more preferably 1 to 12 nm. In a case where the diameter of theparticles to be removed is equal to or smaller than 15 nm, finer coarseparticles can be removed. In a case where the diameter of particles tobe removed is equal to or greater than 1 nm, the filtering efficiency isimproved.

The diameter of particles to be removed means the minimum size ofparticles that can be removed by the filter. For example, in a casewhere the diameter of particles to be removed by the filter is 20 nm,the filter can remove particles having a diameter equal to or greaterthan 20 nm.

Examples of the material of the aforementioned filter include 6-nylon,6,6-nylon, polyethylene, polypropylene, polystyrene, polyimide,polyamide imide, a fluororesin, and the like.

The polyimide and/or polyamide imide may have at least one groupselected from the group consisting of a carboxy group, a salt-typecarboxy group, and a —NH— bond. A fluororesin, polyimide and/orpolyamide imide have excellent solvent resistance.

A filter unit may be constituted with a plurality of filters describedabove. That is, the filter unit may further comprise a filter forremoving particles having a diameter equal to or greater than 50 nm (forexample, a microfiltration membrane for removing fine particles having apore size equal to or greater than 50 nm). In a case where fineparticles are present in the substance to be purified in addition to thecolloidized impurity, particularly, the colloidized impurity containingmetal atoms such as iron or aluminum, by filtering the substance to bepurified by using a filter for removing particles having a diameterequal to or greater than 50 nm (for example, a microfiltration membranefor removing fine particles having a pore size equal to or greater than50 nm) before filtering the substance to be purified by using a filterfor removing particles having a diameter equal to or smaller than 20 nm(for example, a microfiltration membrane having a pore size equal to orsmaller than 20 nm), the filtering efficiency of the filter for removingparticles having a diameter equal to or smaller than 20 nm (for example,a microfiltration membrane having a pore size equal to or smaller than20 nm) is improved, and the coarse particle removing performance isfurther improved.

Metal Ion Removing Step

It is preferable that the filtering step further includes a metal ionremoving step.

As the metal ion removing step, a step of passing the substance to bepurified through a metal ion adsorption filter is preferable. The methodfor passing the substance to be purified through the metal ionadsorption filter is not particularly limited, and examples thereofinclude a method for disposing a metal ion adsorption filter unitcomprising a metal ion adsorption filter and a filter housing in themiddle of a transfer pipe line transferring the substance to be purifiedand passing the substance to be purified through the metal ionadsorption filter unit with or without applying pressure thereto.

The metal ion adsorption filter is not particularly limited, andexamples thereof include known metal ion adsorption filters.

The metal ion adsorption filter is preferably a filter which can performion exchange. Herein, the metal ions to be adsorbed are not particularlylimited. However, at least one kind of metal ion selected from the groupconsisting of Fe, Cr, Ni, and Pb is preferable, and all the metal ionsof Fe, Cr, Ni, and Pb are preferable, because these readily become thecause of a defect in a semiconductor device.

From the viewpoint of improving the metal ion adsorption performance, itis preferable that the metal ion adsorption filter has an acid group onthe surface thereof. Examples of the acid group include a sulfo group, acarboxy group, and the like.

Examples of the base material (material) constituting the metal ionadsorption filter include cellulose, diatomite, nylon, polyethylene,polypropylene, polystyrene, a fluororesin, and the like.

The metal ion adsorption filter may be constituted with materialincluding polyimide and/or polyamide imide. Examples of the metal ionadsorption filter include the polyimide and/or polyamide imide porousmembrane described in JP2016-155121A.

The polyimide and/or polyamide imide porous membrane may contain atleast one group selected from the group consisting of a carboxy group, asalt-type carboxy group, and a —NH— bond. In a case where the metal ionadsorption filter is formed of a fluororesin, polyimide, and/orpolyamide imide, the filter has further improved solvent resistance.

Organic Impurity Removing Step

It is preferable that the filtering step includes an organic impurityremoving step. As the organic impurity removing step, a step of passingthe substance to be purified through an organic impurity adsorptionfilter is preferable. The method for passing the substance to bepurified through the organic impurity adsorption filter is notparticularly limited, and examples thereof include a method fordisposing a filter unit comprising an organic impurity adsorption filterand a filter housing in the middle of a transfer pipe line transferringthe substance to be purified and passing the organic solvent through thefilter unit with or without applying pressure thereto.

The organic impurity adsorption filter is not particularly limited, andexamples thereof include known organic impurity adsorption filters.

In view of improving the organic impurity adsorption performance, it ispreferable that the organic impurity adsorption filter has the skeletonof an organic substance, which can interact with the organic impurity,on the surface thereof (in other words, it is preferable that thesurface of the organic impurity adsorption filter is modified with theskeleton of an organic substance which can interact with the organicimpurity). Examples of the skeleton of an organic substance which caninteract with the organic impurity include a chemical structure whichcan react with the organic impurity so as to make the organic impuritytrapped in the organic impurity adsorption filter. More specifically, ina case where the organic impurity contains long-chain n-alkyl alcohol(structural isomer in a case where long-chain 1-alkyl alcohol is used asan organic solvent), examples of the skeleton of an organic substanceinclude an alkyl group. Furthermore, in a case where the organicimpurity includes dibutylhydroxytoluene (BHT), examples of the skeletonof an organic substance include a phenyl group.

Examples of the base material (material) constituting the organicimpurity adsorption filter include cellulose supporting active carbon,diatomite, nylon, polyethylene, polypropylene, polystyrene, afluororesin, and the like.

Furthermore, as the organic impurity adsorption filter, it is possibleto use the filters obtained by fixing active carbon to non-woven cloththat are described in JP2002-273123A and JP2013-150979A.

For the organic impurity adsorption filter, in addition to the chemicaladsorption described above (adsorption using the organic impurityadsorption filter having the skeleton of an organic substance, which caninteract with the organic impurity, on the surface thereof), a physicaladsorption method can be used.

For example, in a case where the organic impurity contains BHT, thestructure of BHT is larger than 10 Å (=1 nm). Accordingly, in a casewhere an organic impurity adsorption filter having a pore size of 1 nmis used, BHT cannot pass through the pore of the filter. That is, bybeing physically trapped by the filter, BHT is removed from thesubstance to be purified. In this way, for removing an organic impurity,not only a chemical interaction but also a physical removing method canbe used. Here, in this case, a filter having a pore size equal to orgreater than 3 nm is used as “particle removing filter”, and a filterhaving a pore size less than 3 nm is used as “organic impurityadsorption filter”.

In the present specification, 1 Å (angstrom) equals 0.1 nm.

Ion Exchange Step

The filtering step may further include an ion exchange step.

As the ion exchange step, a step of passing the substance to be purifiedthrough an ion exchange unit is preferable. The method for passing thesubstance to be purified through the ion exchange unit is notparticularly limited, and examples thereof include a method fordisposing an ion exchange unit in the middle of a transfer pipe linetransferring the substance to be purified and passing the organicsolvent through the ion exchange unit with or without applying pressurethereto.

As the ion exchange unit, known ion exchange units can be used withoutparticular limitation. Examples of the ion exchange unit include an ionexchange unit including a tower-like container storing an ion exchangeresin, an ion adsorption membrane, and the like.

Examples of an aspect of the ion exchange step include a step in which acation exchange resin or an anion exchange resin provided as a singlebed is used as an ion exchange resin, a step in which a cation exchangeresin and an anion exchange resin provided as a dual bed are used as anion exchange resin, and a step in which a cation exchange resin and ananion exchange resin provided as a mixed bed are used as an ion exchangeresin.

In order to reduce the amount of moisture eluted from the ion exchangeresin, as the ion exchange resin, it is preferable to use a dry resinwhich does not contain moisture as far as possible. As the dry resin,commercial products can be used, and examples thereof include15JS-HG⋅DRY (trade name, dry cation exchange resin, moisture: equal toor smaller than 2%) and MSPS2-1⋅DRY (trade name, mixed bed resin,moisture: equal to or smaller than 10%) manufactured by ORGANOCORPORATION, and the like.

It is preferable that the ion exchange step is performed before thedistillation step described above or before a moisture adjustment stepwhich will be described later.

As another aspect of the ion exchange step, a step of using an ionadsorption membrane can be exemplified.

In a case where the ion adsorption membrane is used, a treatment can beperformed at a high flow rate. The ion adsorption membrane is notparticularly limited, and examples thereof include NEOSEPTA (trade name,manufactured by ASTOM Corporation), and the like.

It is preferable that the ion exchange step is performed after thedistillation step described above. In a case where the ion exchange stepis performed, it is possible to remove the impurities accumulated in thepurification device in a case where the impurities leak or to removesubstances eluted from a pipe made of stainless steel (SUS) or the likeused as a transfer pipe line.

Moisture Adjustment Step

The moisture adjustment step is a step of adjusting the content of watercontained in the substance to be purified. The method for adjusting thecontent of water is not particularly limited, and examples thereofinclude method for adding water to the substance to be purified and amethod for removing water from the substance to be purified.

As the method for removing water, known dehydration methods can be usedwithout particular limitation.

Examples of the method for removing water include a dehydrationmembrane, a water adsorbent insoluble in an organic solvent, an aerationpurging device using dried inert gas, a heating device, a vacuum heatingdevice, and the like.

In a case where the dehydration membrane is used, membrane dehydrationby pervaporation (PV) or vapor permeation (VP) is performed. Thedehydration membrane is constituted as a permeable membrane module, forexample. As the dehydration membrane, it is possible to use a membraneformed of a polymeric material such as a polyimide-based material, acellulose-based material, and a polyvinyl alcohol-based material or aninorganic material such as zeolite.

The water adsorbent is used by being added to the substance to bepurified. Examples of the water adsorbent include zeolite, diphosphoruspentoxide, silica gel, calcium chloride, sodium sulfate, magnesiumsulfate, anhydrous zinc chloride, fuming sulfuric acid, soda lime, andthe like.

In a case where zeolite (particularly, MOLECULAR SIEVE (trade name)manufactured by Union Showa K. K.) is used in the dehydration treatment,olefins can also be removed.

The component adjustment step described above is preferably performedunder a sealed condition in an inert gas atmosphere in which water isless likely to be mixed into the substance to be purified.

Furthermore, in order to inhibit the mixing of moisture as much aspossible, each of the treatments is preferably performed in an inert gasatmosphere in which a dew-point temperature is equal to or lower than−70° C. This is because in the inert gas atmosphere at a temperatureequal to or lower than −70° C., the concentration of moisture in a gasphase is equal to or lower than 2 mass ppm, and hence the likelihoodthat moisture will be mixed into the organic solvent is reduced.

The manufacturing method of a chemical liquid may include, in additionto the above steps, the adsorptive purification treatment step for metalcomponents using silicon carbide described in WO2012/043496A.

It is preferable that the filtering step described above is performedbefore each of the above steps, although the present invention is notparticularly limited to this aspect. In a case where the filtering stepis performed as above, the obtained effects of the present inventionbecome more apparent. The filtering step is referred to as pre-filteringin some cases.

<Other Steps>

As long as the effects of the present invention are exhibited, themanufacturing method of a chemical liquid may include other steps inaddition to the organic solvent preparation step and the purificationstep. Those other steps are not particularly limited, and examplesthereof include an electricity removing step.

(Electricity Removing Step)

The electricity removing step is a step of removing electricity from thesubstance to be purified such that the charge potential of the substanceto be purified is reduced.

As the electricity removing method, known electricity removing methodscan be used without particular limitation. Examples of the electricityremoving method include a method for bringing the substance to bepurified into contact with a conductive material.

The contact time for which the substance to be purified is brought intocontact with a conductive material is preferably 0.001 to 60 seconds,more preferably 0.001 to 1 second, and even more preferably 0.01 to 0.1seconds. Examples of the conductive material include stainless steel,gold, platinum, diamond, glassy carbon, and the like.

Examples of the method for bringing the substance to be purified intocontact with a conductive material include a method for disposing agrounded mesh formed of a conductive material in the interior of a pipeline and passing the substance to be purified through the mesh, and thelike.

It is preferable that the electricity removing step is performed beforeat least one step selected from the group consisting of the preparationstep and the purification step.

[Use of Chemical Liquid]

The use of the chemical liquid is not particularly limited.

Regarding the use of the chemical liquid, it is preferable that thechemical liquid is used in a semiconductor device manufacturing process.The chemical liquid can be used in any step for manufacturing asemiconductor device. Specifically, examples of the use of the chemicalliquid include a prewet solution with which a substrate is coated beforea step of forming a resist film by using a photoresist composition so asto ameliorate the coating properties of the composition, a developer fordeveloping an exposed resist film formed of a photoresist composition,and a rinse solution for washing a developed film. Furthermore, thechemical liquid can be used as a diluent of resist materials containedin a photoresist composition.

Furthermore, the chemical liquid can be suitably used for uses otherthan the manufacturing of a semiconductor. The chemical liquid can beused as a developer and/or rinse solution for polyimide, a resist for asensor, a resist for a lens, and the like.

In addition, the chemical liquid can be used as a solvent for medicaluses or for washing. Particularly, the chemical liquid can be suitablyused for washing a container, a pipe, or a substrate (for example, awafer, glass, or the like).

<Container>

The chemical liquid may be temporarily stored in a container until thechemical liquid is used. As the container for storing the chemicalliquid, known containers can be used without particular limitation.

As the container storing the chemical liquid, a container for asemiconductor is preferable which has a high internal cleanliness andhardly causes elution of impurities.

Examples of the usable container specifically include a “CLEAN BOTTLE”series manufactured by AICELLO CORPORATION, “PURE BOTTLE” manufacturedby KODAMA PLASTICS Co., Ltd., and the like, but the container is notlimited to these. It is preferable that the liquid contact portion ofthe container is formed of a nonmetallic material.

Examples of the nonmetallic material include the materials exemplifiedabove as nonmetallic materials used in the liquid contact portion of thedistillation column.

Particularly, in a case where a container in which the liquid contactportion is formed of a fluororesin among the above materials is used,the occurrence of a problem such as elution of an ethylene or propyleneoligomer can be further inhibited than in a case where a container inwhich the liquid contact portion is formed of a polyethylene resin, apolypropylene resin, or a polyethylene-polypropylene resin is used.

Specific examples of the container in which the liquid contact portionis formed of a fluororesin include FluoroPure PFA composite drummanufactured by Entegris, Inc., and the like. Furthermore, it ispossible to use the containers described on p. 4 in JP1991-502677A(JP-H03-502677A), p. 3 in WO2004/016526A, p. 9 and p. 16 inWO99/046309A, and the like. In a case where the nonmetallic material isused for the liquid contact portion, it is preferable to inhibit theelution of the nonmetallic material into the chemical liquid.

For the liquid contact portion of the container, in addition to theaforementioned nonmetallic material, quartz or a metallic material (morepreferably an electropolished metallic material, in other words, ametallic material finished up with electropolishing) is also preferablyused. The aspect of the electropolished metallic material is asdescribed above.

It is preferable that the interior of the aforementioned container iswashed before the solution is stored into the container. As a liquidused for washing, the chemical liquid itself or a liquid obtained bydiluting the chemical liquid is preferable. After being manufactured,the chemical liquid may be bottled using a container such as a gallonbottle or a quart bottle, transported, and stored. The gallon bottle maybe formed of a glass material or other materials.

In order to prevent the change of the components in the solution duringstorage, purging may be performed in the interior of the container byusing an inert gas (nitrogen, argon, or the like) having a purity equalto or higher than 99.99995% by volume. Particularly, a gas with smallmoisture content is preferable. The temperature at the time of transportand storage may be room temperature. However, in order to preventalteration, the temperature may be controlled within a range of −20° C.to 30° C.

(Clean Room)

It is preferable that all of the manufacturing of the chemical liquid,the opening and/or washing of the container, the handling includingstorage of the solution, the treatment and analysis, and the measurementare performed in a clean room. It is preferable that the clean roommeets the 14644-1 clean room standard. The clean room preferably meetsany of International Organization for Standardization (ISO) class 1, ISOclass 2, ISO class 3, or ISO class 4, more preferably meets ISO class 1or ISO class 2, and even more preferably meets ISO class 1.

[Chemical Liquid Storage Body]

The chemical liquid storage body according to the embodiment of thepresent invention comprises a storage tank and a chemical liquid storedin the storage tank, in which a liquid contact portion which contacts(or is likely to contact) the chemical liquid in the storage tank isformed of a nonmetallic material or electropolished stainless steel.

In the present specification, the storage tank means a tank which isinstalled in a place (a manufacturing site, a business office, and thelike) where the chemical liquid is used, connected to a tank lorry whichwill be described later through a connection member which will bedescribed later, and receives the chemical liquid.

In an aspect of the storage tank, the storage tank has, for example, ahollow tank body which can store the chemical liquid in the interiorthereof, a chemical liquid inlet provided in the tank body, and achemical liquid outlet provided in the tank body.

In the storage tank according to the chemical liquid storage body, aliquid contact portion (for example, the interior wall of the storagetank, the interior wall of the chemical liquid inlet, the interior wallof the chemical liquid outlet, or the like) contacting the chemicalliquid is formed of a nonmetallic material or electropolished stainlesssteel.

In the chemical liquid storage body having the storage tank, even thougha long period of time elapses after the storage of the chemical liquid,the content of the metal impurity in the chemical liquid stored in theinterior of the chemical liquid storage body hardly changes.

Examples of the nonmetallic material include the materials exemplifiedabove as the nonmetallic material used in the liquid contact portion ofthe distillation column.

Examples of the electropolished stainless steel include the stainlesssteels exemplified above that are used in the liquid contact portion ofthe distillation column.

Examples of the method for electropolishing the stainless steel includemethods for electropolishing the metallic material described above.

As the method for forming the liquid contact portion by using anonmetallic material or electropolished stainless steel, known methodscan be used without particular limitation. Examples of the method forforming the liquid contact portion by using a nonmetallic materialinclude a method for coating the liquid contact portion of the storagetank formed of a metallic material (for example, stainless steel) withthe nonmetallic material, a method for forming the storage tank by usingthe nonmetallic material, and the like.

Examples of the method for forming the liquid contact portion of thestorage tank by using electropolished stainless steel include a methodfor electropolishing the liquid contact portion of the storage tankformed of stainless steel, and the like.

In a case where the liquid contact portion of the storage tank formed ofstainless steel is electropolished, buffing may be performed before theelectropolishing. The buffing method is as described above.

As the manufacturing method of a chemical liquid storage body, knownmanufacturing methods can be used without particular limitation.Examples of the manufacturing method of a chemical liquid storage bodyinclude a method for connecting a tank (referred to as “in-vehicle tank”in this paragraph), which is loaded on a tank lorry that will bedescribed later and stores the chemical liquid, to the storage tankthrough a connection member (first connection member which will bedescribed later) and transferring the chemical liquid in the in-vehicletank to the storage tank through the connection member such that thechemical liquid is stored in the storage tank.

In an aspect of the chemical liquid storage body, the ratio(hereinafter, referred to as “void volume”) of a headspace portion inthe container to the internal volume of the container is preferably0.01% to 50% by volume, more preferably 0.5% to 30% by volume, and evenmore preferably 1.0% to 10% by volume. In a case where the void volumeis equal to or smaller than 50% by volume, it is possible to reduce thelikelihood that the impurities in the gas occupying the headspaceportion may be mixed into the chemical liquid stored in the container.

In the present specification, the headspace portion in the containermeans a portion not storing the chemical liquid in the space which canstore the chemical liquid in the container.

The headspace portion may be purged with inert gas (nitrogen, argon, orthe like) having a purity equal to or higher than 99.99995% by volume.Although the inert gas is not particularly limited, it is preferablethat the content of water (water vapor) in the inert gas is small. In acase where the headspace portion is purged with inert gas, even thoughthe chemical liquid storage body is stored for a long period of time,the change of the components of the chemical liquid is furtherinhibited.

Furthermore, in a case where the chemical liquid storage body istransported and/or stored, the temperature of the chemical liquidstorage body may be controlled within a range of −20° C. to 30° C. In acase where the temperature of the chemical liquid storage body iscontrolled within the above range, the change of the components of thechemical liquid stored in the chemical liquid storage body is furtherinhibited.

As the inert gas, a high-purity gas containing few particles ispreferable. In such a gas, for example, the number of particles having adiameter equal to or greater than 0.5 μm is preferably equal to orsmaller than 10/L (liter), and more preferably equal to or smaller than1/L.

[Chemical Liquid Filling Method]

The chemical liquid filling method according to an embodiment of thepresent invention is a method for filling a storage tank with a chemicalliquid by transferring the chemical liquid from a tank lorry comprisinga tank (hereinafter, referred to as “in-vehicle tank” as well) storingthe chemical liquid. The method includes the following steps in thefollowing order.

(1) Connection step: step of connecting in-vehicle tank and storage tankto each other through first connection member

(2) First transferring and filling step: step of transferring chemicalliquid in in-vehicle tank to storage tank through first connectionmember such that storage tank is filled with the chemical liquid

Hereinafter, each of the steps will be specifically described withreference to FIG. 1 (FIG. 1 is a schematic view showing an aspect of amethod for filling a storage tank with a chemical liquid by transferringthe chemical liquid to the storage tank from a tank lorry).

<Connection Step>

The connection step is a step of connecting the in-vehicle tank of thetank lorry and the storage tank to each other through the firstconnection member. As the method for connecting the in-vehicle tank andthe storage tank to each other through the first connection member,known connection methods can be used without particular limitation.

Hereinafter, an aspect of the aforementioned connection method will bedescribed using FIG. 1.

FIG. 1 is a schematic view showing an aspect of a method for connectingan in-vehicle tank 101 of a tank lorry 100 and a storage tank 102 toeach other through a first connection member 103.

The in-vehicle tank 101 comprises a chemical liquid outlet not shown inthe drawing. The chemical liquid outlet is connected to a lorry jointnozzle 105, and a valve 104 is disposed in the middle of the nozzle 105.The lorry joint nozzle 105 is connected to a flange joint 107 through ajoint instrument 106. The other side of the flange joint 107 isconnected to a pipe line 109. A valve 108 is disposed in the middle ofthe pipe line 109. The pipe line 109 is connected to a chemical liquidinlet (not shown in the drawing) that the storage tank 102 comprises.

A packing ring such as an O-ring may be put on the flange joint 107.

The connection step may be performed in a clean room or a clean booth soas to prevent impurities from being mixed into the chemical liquid fromthe connection member.

FIG. 1 shows an aspect in which the first connection member 103 includesthe valve 104, the lorry joint nozzle 105, the joint instrument 106, theflange joint 107, the valve 108, and the pipe line 109. However, theconstitution of the first connection member is not limited to thisconstitution as long as the in-vehicle tank and the storage tank can beconnected to each other.

As the material of the first connection member 103, known materials canbe used without particular limitation.

In view of making it more difficult for the metal impurity containingmetal atoms and the organic impurity to be eluted to the chemical liquidfrom the first connection member 103, it is preferable that the firstconnection member has the following characteristics.

Condition 1: under the condition in which a ratio of a mass (g) of thefirst connection member to a volume (mL) of the chemical liquidtransferred to and filled into the storage tank becomes 10% (g/mL)provided that a liquid temperature of the chemical liquid is 25° C., ina case where the first connection member is immersed for 1 week in thechemical liquid having a liquid temperature of 25° C., the total contentof the metal atoms contained in the metal impurity eluted into thechemical liquid is equal to or smaller than 1.0 mass ppt.

Condition 2: under the condition in which a ratio of a mass (g) of thefirst connection member to a volume (mL) of the chemical liquidtransferred to and filled into the storage tank becomes 10% (g/mL)provided that a liquid temperature of the chemical liquid is 25° C., ina case where the first connection member is immersed for 1 week in thechemical liquid having a liquid temperature of 25° C., the total contentof the organic impurity eluted to the chemical liquid is equal to orsmaller than 1.0 mass ppt.

The liquid contact portion, which contacts the chemical liquid, of atleast one kind of constituent selected from the group consisting of thein-vehicle tank, the storage tank, and the first connection member ismore preferably formed of a nonmetallic material or electropolishedstainless steel. It is even more preferable that the in-vehicle tank,the storage tank, and the first connection member are formed of theaforementioned material.

The aspects of the nonmetallic material and the electropolishedstainless steel are as described above.

In a case where the liquid contact portion of each of the in-vehicletank, the storage tank, and the first connection member is formed of theaforementioned material, in a first transferring and filling step whichwill be described later, it is more difficult for the metal impuritycontaining metal atoms and the organic impurity to be mixed into thechemical liquid.

<First Transferring and Filling Step>

The first transferring and filling step is a step of transferring thechemical liquid in the in-vehicle tank to the storage tank through thefirst connection member such that the storage tank is filled with thechemical liquid. As the transferring and filling method, known fillingmethods can be used without particular limitation.

<Optional Steps>

As long as the effects of the present invention are exhibited, thechemical liquid filling method may further include optional steps inaddition to the aforementioned steps. Examples of the optional stepsinclude the following steps.

(3) Second transferring and filling step: step of transferring chemicalliquid transferred to storage tank to supply tank through secondconnection member such that supply tank is filled with chemical liquid

(4) Third transferring and filling step: step of transferring chemicalliquid transferred to supply tank to device through third connectionmember such that device is filled with chemical liquid

Hereinafter, each of the steps will be described.

(Second Transferring and Filling Step)

The second transferring and filling step is a step of transferring thechemical liquid filled into the storage tank to a supply tank, which isconnected to the storage tank through a second connection member,through the second connection member such that the supply tank is filledwith the chemical liquid.

In the present specification, the supply tank means a tank (feedingtank) which is installed in a place where the chemical liquid is used,does not receive the chemical liquid from the tank lorry describedabove, and has a function of supplying the chemical liquid into a devicewhich will be described later.

As the supply tank, known supply tanks can be used without particularlimitation. In an aspect, the supply tank includes, for example, ahollow tank body which can store the chemical liquid in the interiorthereof, a chemical liquid inlet (connected to the storage tank)provided in the tank body, and a chemical liquid outlet (connected to adevice which will be described later) provided in the tank body.

In the supply tank according to the chemical liquid storage body, theliquid contact portion (for example, the interior wall of the supplytank, the interior wall of the chemical liquid inlet, the interior wallof the chemical liquid outlet, or the like) contacting the chemicalliquid is preferably formed of a nonmetallic material or electropolishedstainless steel. The aspects of the nonmetallic material and theelectropolished stainless steel are as described above.

As the method for connecting the supply tank and the storage tank toeach other through the second connection member, known connectionmethods can be used without particular limitation.

Hereinafter, an aspect of the aforementioned connection method will bedescribed using FIG. 2.

FIG. 2 is a schematic view showing an aspect of a method for filling asupply tank 201 with the chemical liquid by transferring the chemicalliquid to the supply tank 201 from the storage tank 102 and a method forfilling a device 206 (which will be described later) with the chemicalliquid by transferring the chemical liquid to the device 206 from thesupply tank 201.

In FIG. 2, the supply tank 201 is installed in a manufacturing building200 and connected to the storage tank 102 through a second connectionmember 205.

That is, the storage tank 102 comprises a chemical liquid outlet notshown in the drawing, the chemical liquid outlet is connected to a pipeline 202, and the pipe line 202 comprises a valve 203 and a pump 204disposed in the middle of the pipe line 202. The pipe line 202 isconnected to a chemical liquid inlet (not shown in the drawing) that thesupply tank 201 comprises.

FIG. 2 shows an aspect in which the second connection member 205includes the pipe line 202, the valve 203, and the pump 204. However, aslong as the storage tank and the supply tank can be connected to eachother, the constitution of the second connection member 205 is notparticularly limited to this constitution.

For example, an aspect may be adopted in which the second connectionmember 205 further includes a switching valve, and the chemical liquidis transferred to and filled into the supply tank 201 by the switchingof the pipe line 202.

Furthermore, a plurality of storage tanks 102 and/or a plurality ofsupply tanks 201 may be connected to the second connection member 205.In this case, by switching the pipe line 202 by the switching valve, thechemical liquid can be transferred to and filled into one supply tank201 or the plurality of supply tanks 201 from one storage tank 102 orthe plurality of storage tanks 102.

As the material of the second connection member, known materials can beused without particular limitation. It is more preferable that theliquid contact portion, which contacts the chemical liquid, of thesecond connection member is formed of a nonmetallic material orelectropolished stainless steel. The aspects of the nonmetallic materialand the electropolished stainless steel are as described above.

In a case where the liquid contact portion of the second connectionmember is formed of the aforementioned material, it is more difficultfor the metal impurity containing metal atoms and the organic impurityto be mixed into the chemical liquid in the second transferring andfilling step.

In a case where the transferring and filling step according to theembodiment of the present invention includes the second transferring andfilling step, it is more difficult for metal impurities to be elutedinto the chemical liquid.

(Third Transferring and Filling Step)

The third transferring and filling step is a step of transferring thechemical liquid transferred to the supply tank to a device through athird connection member such that device is filled with the chemicalliquid.

In the present specification, the device means a device using thechemical liquid. The device using the chemical liquid is notparticularly limited, but is preferably a semiconductor devicemanufacturing device using the chemical liquid as a prewet solutionand/or a developer.

As the method for connecting the device and the supply tank to eachother through the third connection member, known connection members canbe used without particular limitation.

Hereinafter, an aspect of the aforementioned connection method will bedescribed using FIG. 2.

FIG. 2 is a schematic view showing an aspect of a method for filling thesupply tank 201 with the chemical liquid by transferring the chemicalliquid to the supply tank 201 from the storage tank 102 (the method isas described above) and a method for filling the device 206 with thechemical liquid by transferring the chemical liquid to the device 206from the supply tank 201.

In FIG. 2, the device 206 is installed in the manufacturing building 200and connected to the supply tank 201 through a third connection member210.

That is, the supply tank 201 comprises a chemical liquid outlet notshown in the drawing, the chemical liquid outlet is connected to a pipeline 207, and the pipe line 207 comprises a valve 208, a filter 211, anda pump 209 disposed in the middle of the pipe line 207. The pipe line207 is connected to a chemical liquid inlet (not shown in the drawing)that the device 206 comprises.

FIG. 2 shows an aspect in which the third connection member 210 includesthe pipe line 207, the valve 208, the pump 209, and the filter 211.However, as long as the supply tank and the device can be connected toeach other, the constitution of the third connection member 210 is notlimited to this constitution.

For example, an aspect may be adopted in which the third connectionmember 210 further includes a switching valve, and the chemical liquidis transferred to and filled into device 206 by the switching of thepipe line 207.

Furthermore, a plurality of supply tanks 201 and/or a plurality ofdevices 206 may be connected to the third connection member 210. In thiscase, by switching the pipe line 207 by using the switching valve, thechemical liquid can be transferred to and filled into one device 206 orthe plurality of devices 206 from one supply tank 201 or the pluralityof supply tanks 201.

According to the aspect in which the third connection member includesthe filter 211, the chemical liquid can be transferred to and filledinto the device in a state where the amount of the metal impurity and/orthe organic impurity is further reduced. The aspect of the filter is asdescribed above.

In the manufacturing method of a chemical liquid described above, it ispreferable that a portion which contacts (or is likely to contact) thechemical liquid in the devices and steps (including the connection step,the filling step, the in-vehicle tank, and the storage tank) relating tomanufacturing⋅storage⋅transport is washed before the manufacturing ofthe chemical liquid according to the embodiment of the presentinvention. The liquid used for washing is not particularly limited, butis preferably the chemical liquid according to the embodiment of thepresent invention or a liquid obtained by diluting the chemical liquidaccording to the embodiment of the present invention. As the liquid usedfor washing, it is possible to use an organic solvent whichsubstantially does not contain particles containing metal atoms, metalion components, organic impurities, and the like or an organic solventin which the content of these is sufficiently reduced. The washing maybe performed plural times. Furthermore, for the washing, two or morekinds of different organic solvents may be used, or a mixture thereofmay be used. The washing may be circulation washing.

Whether the devices relating to manufacturing are sufficiently washedcan be judged by measuring metal atoms and metal ion componentscontained in the liquid used for washing. The washing is performed untilthe content of metal atoms, which is an indicator of washing, containedin the liquid used for washing preferably becomes equal to or smallerthan 10 mass ppm, more preferably becomes equal to or smaller than 0.1mass ppm, and particularly preferably becomes equal to or smaller than0.001 mass ppm. In a case where the washing is performed as describedabove, the obtained effects of the present invention become moreapparent.

As the material of the third connection member, known materials can beused without particular limitation. Particularly, the liquid contactportion, which contacts the chemical liquid, of the third connectionmember is more preferably formed of a nonmetallic material orelectropolished stainless steel. The aspects of the nonmetallic materialand the electropolished stainless steel are as described above.

In a case where the liquid contact portion of the third connectionmember is formed of the aforementioned materials, it is more difficultfor the metal impurity containing metal atoms and the organic impurityto be mixed into the chemical liquid in the third transferring andfilling step.

[Chemical Liquid Storage Method]

The chemical liquid storage method according to an aspect of the presentinvention is a storage method for storing a chemical liquid stored in astorage tank, which includes an adjustment step of adjusting at leastone item described below. It is preferable that the chemical liquidstorage method includes an adjustment step of adjusting all of thefollowing items.

-   -   Temperature of chemical liquid    -   Internal pressure of storage tank    -   Relative humidity of headspace portion in storage tank

Hereinafter, the adjustment method for each of the items will bedescribed.

<Item 1 to be Adjusted: Temperature of Chemical Liquid>

It is preferable that the adjustment step includes a step of adjustingthe temperature of the chemical liquid in the storage tank.

The temperature of the chemical liquid is not particularly limited, butis preferably adjusted to be 5° C. to 50° C. in general and morepreferably adjusted to be 10° C. to 30° C. According to the chemicalliquid storage method having the step of adjusting the temperature ofthe chemical liquid to be 10° C. to 30° C., it is more difficult for themetal impurity containing metal atoms and the organic impurity to beeluted into the chemical liquid during storage.

As the method for adjusting the temperature of the chemical liquid,known methods can be used without particular limitation.

<Item 2 to be Adjusted: Internal Pressure of Storage Tank>

It is preferable that the adjustment step includes a step of adjustingthe internal pressure of the storage tank.

The internal pressure of the storage tank is not particularly limited,but is preferably adjusted to be 0.05 to 1.5 MPa in general, and morepreferably adjusted to be 0.1 to 1.0 MPa. According to the chemicalliquid storage method having a step of adjusting the internal pressureof the storage tank to be 0.1 to 1.0 MPa, it is more difficult for themetal impurity containing metal atoms and the organic impurity to beeluted into the chemical liquid during storage.

As the method for adjusting the internal pressure of the storage tank,known methods can be used without particular limitation.

<Item 3 to be Adjusted: Relative Humidity of Headspace Portion inStorage Tank>

It is preferable that the adjustment step includes a step of adjustingthe relative humidity of the headspace portion in the storage tank.

The relative humidity of the headspace portion of the storage tank isnot particularly limited, but is preferably adjusted to be 5% to 95% ingeneral, and more preferably adjusted to be 30% to 90%. According to thechemical liquid storage method having a step of adjusting the relativehumidity of the headspace portion of the storage tank to be 30% to 90%,it is more difficult for the metal impurity containing metal atoms andthe organic impurity to be eluted into the chemical liquid duringstorage.

In the present specification, the headspace portion in the storage tankmeans a portion which does not store the chemical liquid in the spacewhich can store the chemical liquid in the storage tank.

As the method for adjusting the relative humidity of the headspaceportion in the storage tank, known methods can be used withoutparticular limitation.

In an aspect of the storage tank, a ratio (hereinafter, referred to as“void volume” as well) of the headspace portion in the storage tank tothe internal volume of the storage tank is preferably 0.01% to 50% byvolume, more preferably 0.5% to 30% by volume, and even more preferably1.0% to 10% by volume. In a case where the void volume is equal to orsmaller than 50% by volume, it is possible to reduce the likelihood thatthe impurities in the gas occupying the headspace portion will be mixedinto the chemical liquid stored in the storage tank.

EXAMPLES

Hereinafter, the present invention will be more specifically describedbased on examples. The materials, the amount and proportion of thematerials used, the details of treatments, the procedure of treatments,and the like shown in the following examples can be appropriatelymodified as long as the gist of the present invention is maintained.Accordingly, the scope of the present invention is not limited to thefollowing examples.

[Preparation of Substance to be Purified Containing Organic Solvent]

In order to manufacture chemical liquids of examples and comparativeexamples, substances to be purified containing each of the followingorganic solvents were prepared. As each of the substances to bepurified, a commercial product called “high-purity grade” containing anorganic solvent in an amount equal to or greater than 99% by mass wasused. The abbreviation for each organic solvent is shown in the bracket.

-   -   Butyl acetate (nBA)    -   Propylene glycol monomethyl ether (PGME)    -   Propylene glycol monoethyl ether (PGEE)    -   Propylene glycol monopropyl ether (PGPE)    -   Solvent 1: hexyl alcohol    -   Solvent 2: 2-heptanone    -   Solvent 3: isoamyl acetate    -   Propylene glycol monomethyl ether acetate (PGMEA)    -   Cyclopentanone (CyPe)    -   Cyclohexanone (CyHe)    -   γ-Butyrolactone (GBL)    -   2-Hydroxymethyl butyrate (HBM)    -   Cyclohexanone dimethyl acetal (CHdMA)    -   Ethyl lactate (EL)

Example 1: Preparation of Chemical Liquid 1

A substance to be purified containing butyl acetate (nBA) as an organicsolvent was prepared, and a chemical liquid 1 was manufactured by thefollowing method. The chemical liquid was manufactured using a device inwhich a stainless steel tank having a coating layer formed ofpolytetrafluoroethylene (PTFE) in a liquid contact portion was connectedto a plurality of filter units through a circulation pipe line.Furthermore, a pump was disposed in the middle of the circulation pipeline. The liquid contact portion of each of the circulation pipe lineand the pump was formed of polytetrafluoroethylene. Furthermore, filtersdisposed in the following order from the tank side were used.

-   -   First metal ion adsorption filter (15 nm IEX PTFE manufactured        by Entegris, Inc. (filter made of PTFE having a pore size of 15        nm including a base material having a sulfo group on the surface        thereof))    -   Particle removing filter (12 nm PTFE manufactured by Entegris,        Inc. (filter made of PTFE having a pore size of 12 nm))    -   Second metal ion adsorption filter (15 nm IEX PTFE manufactured        by Entegris, Inc. (filter made of PTFE having a pore size of 15        nm including a base material having a sulfo group on the surface        thereof))    -   Organic impurity adsorption filter (special filter A (filter        described in JP2013-150979A obtained by fixing active carbon to        non-woven cloth))

The downstream side of the organic impurity adsorption filter wasprovided with moisture adjustment means containing MOLECULAR SIEVE 3A(manufactured by Union Showa K. K., dehydrating agent).

Butyl acetate (nBA) was stored in the tank and then circulated 10 timesthrough the pipe line including the filter and the moisture adjustmentmeans described above, thereby obtaining the chemical liquid 1.

Thereafter, the prepared chemical liquid 1 was stored in an in-vehicletank of a tank lorry (liquid contact portion was formed of PTFE). Then,the chemical liquid 1 was stored in a storage tank through a firstconnection member (a lorry joint nozzle, a joint instrument, a flangejoint, an O-ring, and a pipe line). A liquid contact portion of theconnection member and a liquid contact portion of the storage tank weremade of PTFE.

Examples 2 to 52 and Comparative Examples 1 to 10: Preparation ofChemical Liquids

Chemical liquids were prepared in the same manner as in Example 1,except that substances to be purified containing each of the organicsolvents described in Table 1 were used, and the liquid contact portionof the connection member and the liquid contact portion of the storagetank were formed of the materials described in Table 1. Each of thechemical liquids was stored in the storage tank. The composition of eachof the chemical liquids described in Table 1 was adjusted by changingthe material used, the number of times the chemical liquid passedthrough the filter, presence or absence of the filter, and the like.

For preparing the chemical liquids of Examples 4, 5, 29 and 30 andComparative Examples 3, 4, 8, and 9, the organic impurity adsorptionfilter was not used.

For preparing the chemical liquids of Examples 17 and 44, MOLECULARSIEVE 3A was not used.

For preparing the chemical liquids of Examples 18 and 45 and ComparativeExamples 1 and 6, the particle removing filter was not used.

[Method for Measuring Content of Each Component Contained in ChemicalLiquid, and the Like]

For measuring the content of each component contained in the chemicalliquid stored in the storage tank, and the like, the following methodwas used. All of the following measurements were performed in a cleanroom that met the level equal to or lower than InternationalOrganization for Standardization (ISO) Class 2. In order to improve themeasurement accuracy, at the time of measuring each component, in a casewhere the content of the component was found to be equal to or smallerthan a detection limit by general measurement, the organic solvent wasconcentrated by 1/100 in terms of volume for performing the measurement,and the content was calculated by converting the concentration into thecontent of the organic solvent not yet being concentrated. The resultsare summarized in Table 1 and Table 2.

<Content of Organic Solvent, Organic Impurity, and Alcohol Impurity>

The content of the organic solvent, the organic impurity, and thealcohol impurity contained in the chemical liquid stored in the storagetank was measured using a gas chromatography mass spectrometer(tradename “GCMS-2020”, manufactured by Shimadzu Corporation).

(Measurement condition)

Capillary column: InertCap 5MS/NP 0.25 mmI.D.×30 m df=0.25 μm

Sample introduction method: slit 75 kPa constant pressure

Vaporizing chamber temperature: 230° C.

Column oven temperature: 80° C. (2 min)-500° C. (13 min) heating rate15° C./min

Carrier gas: helium

Septum purge flow rate: 5 mL/min

Split ratio: 25:1

Interface temperature: 250° C.

Ion source temperature: 200° C.

Measurement mode: Scan

Amount of sample introduced: 1 μL

<Total Content of Metal Atoms Contained in Metal Impurity and Content ofFe Atom, Cr Atom, Ni Atom, and Pb Atom>

The total content of the metal atoms contained in the metal impurity inthe chemical liquid stored in the storage tank and the content of apredetermined metal atom were measured using Agilent 8800 triplequadrupole ICP-MS (for semiconductor analysis, option #200).

(Measurement Condition)

As a sample introduction system, a quartz torch, a coaxialperfluoroalkoxyalkane (PFA) nebulizer (for self-suction), and a platinuminterface cone were used. The measurement parameters of cool plasmaconditions are as below.

-   -   Output of Radio Frequency (RF) (W): 600    -   Flow rate of carrier gas (L/min): 0.7    -   Flow rate of makeup gas (L/min): 1    -   Sampling depth (mm): 18

<Water>

The content of water contained in the chemical liquid stored in thestorage tank was measured using a Karl Fischer moisture meter (tradename “MKC-710M”, manufactured by KYOTO ELECTRONICS MANUFACTURING CO.,LTD., Karl Fischer coulometric titration method).

[Physical Properties of Chemical Liquid]

The physical properties of the chemical liquid stored in the storagetank were measured or calculated by the following method.

<Mass Ratio of Total Content of Component Having Boiling Point Equal toor Higher than 250° C. to Total Content of Component Having BoilingPoint Lower than 250° C.>

The mass ratio of the total content of the component having a boilingpoint equal to or higher than 250° C. to the total content of thecomponent having a boiling point lower than 250° C. in the chemicalliquid stored in the storage tank was calculated by the followingequation based on the measurement results obtained from the organicsolvent and the organic impurity.Mass ratio of total content of component having boiling point equal toor higher than 250° C. to total content of component having boilingpoint lower than 250° C.=S _(H) /S ₀  (Equation)

In the above equation, S_(H) represents the total content (mass ppm) ofthe component having a boiling point equal to or higher than 250° C. inthe chemical liquid, and S₀ represents the total content (mass ppm) ofthe component having a boiling point lower than 250° C. in the chemicalliquid.

<Number of Coarse Particles>

The number of coarse particles contained in the chemical liquid storedin the storage tank was measured by the following method.

First, the chemical liquid stored in the storage tank was left to standfor 1 day at room temperature after storage. By using a lightscattering-type liquid-borne particle counter (manufactured by RION Co.,Ltd., model number: KS-18F, light source: semiconductor laser-excitedsolid-state laser (wavelength: 532 nm, rated power: 500 mW), flow rate:10 mL/min, the measurement principle is based on a dynamic lightscattering method), the number of particles having a size equal to orgreater than 100 nm contained in 1 mL of the chemical liquid having beenleft to stand was counted 5 times, and the average thereof was adoptedas the number of coarse particles.

The light scattering-type liquid-borne particle counter was used afterbeing calibrated using a Polystyrene Latex (PSL) standard particlesolution.

[Evaluation]

The chemical liquid stored in the storage tank was evaluated by thefollowing method. All of the following evaluation tests were performedin a clean room that met the level equal to or lower than InternationalOrganization for Standardization (ISO) Class 2.

<Elution Test: First Connection Member>

First, the total content of the organic impurity contained in each ofthe chemical liquids described in Table 1 and Table 2 and the totalcontent of metal atoms in the metal impurity were measured. Themeasurement method is as described above.

Then, under the condition in which the ratio of the mass of the firstconnection member to the volume of the chemical liquid having a liquidtemperature of 25° C. corresponding to each of the examples and thecomparative examples became 10% (g/mL), each of the first connectionmembers described in Tables 1 and 2 was immersed for 1 week in thechemical liquid having a liquid temperature of 25° C. corresponding toeach of the examples and the comparative examples. Thereafter, the firstconnection member was pulled up from each of the chemical liquids, andfor each of the chemical liquids used for immersion, the total contentof the organic impurity and the total content of the metal atoms in themetal impurity were measured by the same method as described above.

Subsequently, the increase in the total content of the organic impuritybefore and after the immersion and the increase in the total content ofthe metal atoms before and after the immersion were calculated andadopted as an elution amount. The results are shown in Tables 1 and 2.

<Elution Test: Storage Tank>

First, the total content of the metal atoms in the metal impuritycontained in each of the chemical liquids described in Tables 1 and 2was measured. The measurement method is as described above.

Then, a test piece having a size of 2 cm (length)×2 cm (width)×0.5 cm(thickness) made of the material of the liquid contact portion of eachof the storage tanks shown in Table 1 and Table 2 was cut, immersed inthe chemical liquid having a liquid temperature of 25° C. of each of theexamples, and left to stand for 1 week in a thermostat in a state ofbeing kept at 25° C. Thereafter, the test piece was taken out, and thetotal content of the metal atoms in the metal impurity contained in thechemical liquid used for immersion was measured.

Subsequently, the increase (unit: mass ppt) in the total content of themetal atoms in the chemical liquid before and after the immersion wascalculated and adopted the result of an elution test. The results areshown in Tables 1 and 2.

<Temporal Change of Total Content of Metal Atoms in Chemical LiquidStored in Storage Tank>

Each of the chemical liquids stored in the storage tank was stored for300 days at room temperature. At points in time when 100 days, 200 days,and 300 days elapsed from the start of the storage, a portion of each ofthe chemical liquids was extracted as a sample from the storage tank,and by using Agilent 8800 ICP-MS, the total content of the metal atomscontained in the metal impurity in the chemical liquid was measured. Theresults are shown in Table 1.

<Temporal Stability of Chemical Liquid Stored in Storage Tank>

Each of the chemical liquids stored in the storage tank was stored for300 days at room temperature. Then, a portion of each of the chemicalliquids was extracted as a sample from the storage tank, and by GCMS(the measurement method is the same as described above), the content ofthe organic solvent contained in the chemical liquid was measured.

The measured content was compared with the content of the organicsolvent contained in each of the chemical liquids just stored in thestorage tank, and the change (% by mass, an absolute value) in thecontent was measured.

The results were evaluated by the following method and shown in Table 1.

A: the change of the content of the organic solvent contained in thechemical liquid was 0% to 1% by mass.

B: the change of the content of the organic solvent contained in thechemical liquid was 1% to 5% by mass.

C: the change of the content of the organic solvent contained in thechemical liquid was greater than 5% by mass.

<Evaluation of Developability and Defect Inhibition Performance(Developer)>

The developability and the defect inhibition performance demonstrated ina case where the chemical liquids of Examples 1 to 25 and ComparativeExamples 1 to 5 were used as a developer were evaluated.

First, a silicon wafer was coated with ARC29A (manufactured by NISSANCHEMICAL INDUSTRIES, LTD.) as a composition for forming an organicantireflection film, and the coating film was baked for 60 seconds at205° C., thereby forming a 78 nm antireflection film.

Then, by using a spin coater, the antireflection film was coated withFAiRS-9101A12 (ArF positive resist composition manufactured by FUJIFILMElectronic Materials Co., Ltd.) and baked for 60 seconds at 100° C.,thereby forming a resist film having a film thickness of 150

By using an ArF excimer laser scanner (NA 0.75), the obtained wafer wasexposed at 25 mJ/cm2 and then heated for 60 seconds at 120° C.

Thereafter, by using each of the chemical liquids shown in Table 1, thewafer was developed (negative development) for 30 seconds and rinsed for30 seconds by using 4-methyl-2-pentanol (MIBC), thereby obtaining apattern having a pitch of 200 nm and a line width of 100 nm.

(Defect Inhibition Performance)

By using a pattern defect device (for example, a MULTIPURPOSE ScanningElectron Microscope (SEM) Inspago RS6000 series manufactured byHitachi-High Technologies Corporation), the number of defects on thepattern of the wafer on which the resist pattern was formed wasmeasured. The results were evaluated based on the following standards.The results are shown in Table 1.

—Evaluation Standards—

AA: the number of defects was equal to or smaller than 20.

A: the number of defects was greater than 20 and equal to or smallerthan 50.

B: the number of defects was greater than 50 and equal to or smallerthan 100.

C: the number of defects was greater than 100 and equal to or smallerthan 150.

D: the number of defects was greater than 150.

(Developability)

By using a Scanning Electron Microscope (SEM), whether or not a residuewas in a region (unexposed portion), which was not irradiated with lightin the step of exposing the wafer on which the resist pattern wasformed, was measured. The results were evaluated based on the followingstandards. The results are shown in Table 1.

—Evaluation Standards—

A: no residue was confirmed in the unexposed portion.

B: a few residues were confirmed in the unexposed portion, but theresidues were unproblematic for practical use.

C: residues were confirmed in the unexposed portion, but the residueswere acceptable for practical use.

D: residues were clearly confirmed in the unexposed portion.

<Evaluation of Developability and Defect Inhibition Performance (PrewetSolution)>

The developability and the defect inhibition performance demonstrated ina case where the chemical liquids of Examples 26 to 52 and ComparativeExamples 6 to 10 were used as a prewet solution were evaluated.

First, the prewet solution (each of the chemical liquids shown in Table2) was added dropwise to the surface of a silicon wafer, and the waferwas spin-coated with the solution.

Then, the silicon wafer was coated with ARC29SR (manufactured by NISSANCHEMICAL INDUSTRIES, LTD.) as a composition for forming an organicantireflection film, and the coating film was baked for 60 seconds at205° C., thereby forming an antireflection film having a film thicknessof 95 nm.

Thereafter, the obtained antireflection film was coated withFAiRS-9101A12 (ArF positive resist composition manufactured by FUJIFILMElectronic Materials Co., Ltd.) and baked (PB: Prebake) for 60 secondsat 100° C., thereby forming a resist film having a film thickness of 90nm.

By using an ArF excimer laser immersion scanner (manufactured by ASML;XT1700i, NA1.20, Dipole (outer σ: 0.981/inner σ: 0.895), Y-polarized),the obtained wafer was pattern-wise exposed through a halftone mask. Asan immersion liquid, ultrapure water was used. Then, the wafer washeated for 60 seconds at 105° C. (PEB: Post Exposure Bake). Thereafter,the wafer was subjected to puddle development for 30 seconds by using anegative developer. Subsequently, the wafer was rotated for 30 secondsat a rotation speed of 4,000 rpm, thereby forming a negative resistpattern. The developability and the defect inhibition performance of theobtained resist pattern were evaluated by the method described above.The results are shown in Table 2.

Regarding the content of the organic solvent, “balance” means thecontent of the organic solvent obtained by subtracting the content ofthe organic impurity and the content of the metal impurity from thetotal mass of the chemical liquid. In all of the examples and thecomparative examples, the content of the organic solvent was equal to orgreater than 98% by mass.

Regarding the details of the organic impurity in Comparative Example 3,the content of n-butanol was 1,500 mass ppm, the content of acetic acidwas 1,200 mass ppm, the content of dibutyl ether was 6,200 mass ppm, andthe content of isobutyl acetate was 6,100 mass ppm.

In the tables, the column of “Organic impurity” shows the total contentof the organic impurity.

Furthermore, in the tables, the column of “Others” shows the metal atomssuch as Na, K, Ca, Cu, Mg, Mn, Li, Al, and Sn.

The abbreviations in the tables represent the following.

(Material of Liquid Contact Portion of Storage Tank)

-   -   PTFE: the liquid contact portion was made of        polytetrafluoroethylene (here, the storage tank was made of        stainless steel).    -   PP: the liquid contact portion was made of polypropylene (here,        the storage tank was made of stainless steel).    -   SUS (1): the liquid contact portion was made of stainless steel        (not being electropolished, here, the storage tank was made of        stainless steel as well).    -   SUS (2): the liquid contact portion was made of electropolished        stainless steel (here, the storage tank was made of stainless        steel)    -   PTFE (2): the liquid contact portion was made of        polytetrafluoroethylene (here, the storage tank was made of        polytetrafluoroethylene as well).

(Material of First Connection Member)

-   -   PTFE (2): the liquid contact portion was made of        polytetrafluoroethylene (here, the first connection member was        made of polytetrafluoroethylene as well).    -   PP: the liquid contact portion was made of polypropylene (here,        the first connection member was made of stainless steel).    -   SUS (1): the liquid contact portion was made of stainless steel        (not being electropolished, here, the first connection member        was made of stainless steel as well).

What the abbreviations mean is also applied to each table.

Table 1 is divided into Table 1-1 to Table 1-6. The composition of thechemical liquid of each of the examples and the comparative examples,the physical properties of the chemical liquid, the material of theliquid contact portion of the storage tank and the first connectionmember, and the evaluation results are described in the rows of Table1-1 to Table 1-6.

For example, regarding the composition of the chemical liquid of Example1, it was confirmed that the total content [A] of the organic impuritywas 500 mass ppm, the content [B] of the alcohol impurity in the organicimpurity was 25 mass ppm, and B/A equaled 0.05. Regarding the metalatoms in the chemical liquid of Example 1, it was confirmed that thecontent of Fe was 2 mass ppt (0.12 with respect to the total content ofthe metal atoms), the content of Cr was 1 mass ppt (0.06 with respect tothe total content of the metal atoms), the content of Ni was 2 mass ppt(0.12 with respect to the total content of the metal atoms), the contentof Pb was 1 mass ppt (0.06 with respect to the total content of themetal atoms), the content of others was 11 mass ppt (0.65 with respectto the total content of the metal atoms), and the total content of themetal atoms was 17 mass ppt. It was confirmed that in the chemicalliquid of Example 1, the water content was 0.10% by mass, and thebalance was nBA.

Regarding the physical properties of the chemical liquid of Example 1,it was confirmed that the mass ratio (in the table, described as“High-boiling-point compound/low-boiling-point compound”) of the totalcontent of the component having a boiling point equal to or higher than250° C. to the total content of the component having a boiling pointlower than 250° C. was 0.00020, and the number of coarse particles was8/ml.

It was confirmed that the material of the liquid contact portion of thestorage tank storing the chemical liquid of Example 1 was “PTFE”, andthe material of the liquid contact portion of the first connectionmember used for storage was “PTFE (2)”.

According to the evaluation results, it was confirmed that the amount ofthe metal impurity eluted from the liquid contact portion of the storagetank used for storing the chemical liquid of Example 1 was less than 1mass ppt, the amount of the metal impurity eluted from the liquidcontact portion of the first connection member used for storing thechemical liquid of Example 1 was less than 1 mass ppt, and the amount ofthe organic impurity eluted from the liquid contact portion of the firstconnection member was less than 1 mass ppt.

According to the evaluation results of the chemical liquid storage bodyincluding the storage tank storing the chemical liquid of Example 1,regarding the temporal change of the total content of the metal atoms inthe chemical liquid stored in the storage tank, it was confirmed thatthe total content of the metal atoms was 18 mass ppt after 100 days, 18mass ppt after 200 days, and 18 mass ppt after 300 days.

Regarding the temporal stability of the chemical liquid of Example 1stored in the storage tank, it was confirmed that the difference betweenthe content of the organic solvent contained in each of the chemicalliquids just stored in the storage tank and the change in the content ofthe organic solvent after the storage for 300 days was evaluated as “A”.

It was confirmed that the evaluation results of the developability andthe defect inhibition performance demonstrated in a case where thechemical liquid of Example 1 was used as a developer were “A” and “AA”respectively.

Other examples and comparative examples in Table 1 can be analyzed inthe same manner as described above.

Table 2 is also divided into Table 2-1 to Table 2-6. The composition ofthe chemical liquid of each of the examples and the comparativeexamples, the physical properties of the chemical liquid, the materialof the liquid contact portion of the storage tank and the firstconnection member, and the evaluation results are described in the rowsof Table 2-1 to Table 2-6.

TABLE 1-1 Organic impurity Organic solvent Organic Alcohol Contentimpurity impurity (% by (mass ppm) (mass ppm) [B]/ Type mass) [A] [B][A] Example 1 nBA Balance 500 25 0.05 Example 2 nBA Balance 500 25 0.05Example 3 nBA Balance 500 25 0.05 Example 4 nBA Balance 3000 25 0.01Example 5 nBA Balance 8000 25 0.003 Example 6 nBA Balance 1000 25 0.03Example 7 nBA Balance 1500 25 0.02 Example 8 Solvent 1 Balance 500 300.06 Example 9 Solvent 2 Balance 500 20 0.04 Example 10 Solvent 3Balance 500 20 0.04 Example 11 nBA Balance 500 100 0.2 Example 12 nBABalance 500 200 0.4 Example 13 nBA Balance 500 25 0.05 Example 14 nBABalance 500 25 0.05 Example 15 nBA Balance 500 25 0.05 Example 16 nBABalance 500 25 0.05 Example 17 nBA Balance 500 25 0.05 Example 18 nBABalance 500 25 0.05 Example 19 nBA Balance 500 25 0.05 Example 20 nBABalance 500 25 0.05 Example 21 nBA Balance 500 25 0.05 Example 22 nBABalance 500 25 0.05 Example 23 nBA Balance 500 25 0.05 Example 24 nBABalance 500 25 0.05 Example 25 nBA Balance 500 25 0.05 Comparative nBABalance 500 25 0.05 Example 1 Comparative nBA Balance 0.05 0.03 0.60Example 2 Comparative nBA Balance 15000 1500 0.10 Example 3 ComparativenBA Balance 3000 0.1 0.00003 Example 4 Comparative nBA Balance 1500 14000.93 Example 5

TABLE 1-2 Metal atoms contained in metal impurity Fe Cr Ni Mass MassMass ratio ratio ratio Content (Fe/ Content (Cr/ Content (Ni/ (Mass ppt)total) (Mass ppt) total) (Mass ppt) total) Example 1 2 0.12 1 0.06 20.12 Example 2 10 0.27 3 0.08 9 0.24 Example 3 14 0.31 4 0.09 12 0.27Example 4 2 0.10 1 0.05 3 0.14 Example 5 2 0.11 1 0.05 3 0.16 Example 63 0.17 1 0.06 3 0.17 Example 7 3 0.17 1 0.06 4 0.22 Example 8 3 0.16 10.05 2 0.11 Example 9 3 0.14 1 0.05 3 0.14 Example 10 2 0.12 1 0.06 30.18 Example 11 2 0.11 2 0.11 3 0.16 Example 12 6 0.22 2 0.07 4 0.15Example 13 2 0.12 1 0.06 3 0.18 Example 14 7 0.25 2 0.07 4 0.14 Example15 2 0.11 1 0.06 4 0.22 Example 16 3 0.14 1 0.05 3 0.14 Example 17 20.09 1 0.04 4 0.17 Example 18 2 0.11 1 0.05 3 0.16 Example 19 2 0.11 10.05 2 0.11 Example 20 2 0.11 1 0.06 2 0.11 Example 21 3 0.15 1 0.05 40.20 Example 22 2 0.10 1 0.05 3 0.14 Example 23 2 0.10 1 0.05 3 0.14Example 24 2 0.12 0.1 0.006 2 0.12 Example 25 2 0.08 1 0.04 2 0.08Comparative 166 0.27 112 0.18 158 0.26 Example 1 Comparative 2 0.13 10.06 2 0.13 Example 2 Comparative 3 0.16 1 0.05 2 0.11 Example 3Comparative 2 0.11 1 0.05 3 0.16 Example 4 Comparative 2 0.11 1 0.06 30.17 Example 5

TABLE 1-3 Metal atoms contained in metal impurity Pb Others Mass MassWater ratio ratio Total content Content (Pb/ Content (Others/ (Mass (%By (Mass ppt) total) (Mass ppt) total) ppt) mass) Example 1 1 0.06 110.65 17 0.10% Example 2 3 0.08 12 0.32 37 0.10% Example 3 3 0.07 12 0.2745 0.10% Example 4 1 0.05 14 0.67 21 0.10% Example 5 1 0.05 12 0.63 190.10% Example 6 1 0.06 10 0.56 18 0.10% Example 7 1 0.06 9 0.50 18 0.10%Example 8 1 0.05 12 0.63 19 0.10% Example 9 1 0.05 13 0.62 21 0.10%Example 10 1 0.06 10 0.59 17 0.10% Example 11 1 0.05 11 0.58 19 0.10%Example 12 3 0.11 12 0.44 27 0.10% Example 13 1 0.06 10 0.59 17 0.10%Example 14 3 0.11 12 0.43 28 0.10% Example 15 1 0.06 10 0.56 18 0.10%Example 16 1 0.05 13 0.62 21 0.10% Example 17 1 0.04 15 0.65 23 1.70%Example 18 1 0.05 12 0.63 19 0.10% Example 19 1 0.05 13 0.68 19 0.10%Example 20 1 0.06 12 0.67 18 0.10% Example 21 1 0.05 11 0.55 20 0.07%Example 22 1 0.05 14 0.67 21 0.10% Example 23 1 0.05 14 0.67 21 0.10%Example 24 1 0.06 11 0.68 16 0.10% Example 25 8 0.33 11 0.46 24 0.10%Comparative 106 0.17 68 0.11 610 0.10% Example 1 Comparative 1 0.06 100.63 16 0.10% Example 2 Comparative 1 0.05 12 0.63 19 0.10% Example 3Comparative 1 0.05 12 0.63 19 0.10% Example 4 Comparative 1 0.06 11 0.6118 0.10% Example 5

TABLE 1-4 Physical properties of chemical liquid Material of liquidHigh-boiling- Number of contact portion point compound/ coarse Firstlow-boiling- particles Storage connection point compound (number/ml)tank member Example 1 0.000020 8 PTFE PTFE (2) Example 2 0.000020 15PTFE PTFE (2) Example 3 0.000020 23 PTFE PTFE (2) Example 4 0.000050 7PTFE PTFE (2) Example 5 0.000080 6 PTFE PTFE (2) Example 6 0.000200 7PTFE PTFE (2) Example 7 0.000800 6 PTFE PTFE (2) Example 8 0.000020 7PTFE PTFE (2) Example 9 0.000020 6 PTFE PTFE (2) Example 10 0.000020 8PTFE PTFE (2) Example 11 0.000020 8 PTFE PTFE (2) Example 12 0.000020 8PTFE PTFE (2) Example 13 0.000020 8 PTFE PP Example 14 0.000020 8 PTFESUS (1) Example 15 0.000020 8 PP PTFE (2) Example 16 0.000020 8 SUS (1)PTFE (2) Example 17 0.000020 8 PTFE PTFE (2) Example 18 0.000020 165PTFE PTFE (2) Example 19 0.000020 8 SUS (2) PTFE (2) Example 20 0.0000208 PTFE (2) PTFE (2) Example 21 0.000020 8 PTFE PTFE (2) Example 220.000007 7 PTFE PTFE (2) Example 23 0.0020 7 PTFE PTFE (2) Example 240.000020 8 PTFE PTFE (2) Example 25 0.000020 8 PTFE PTFE (2) Comparative0.000020 256 PTFE PTFE (2) Example 1 Comparative 0.000020 7 PTFE PTFE(2) Example 2 Comparative 0.000020 7 PTFE PTFE (2) Example 3 Comparative0.000020 7 PTFE PTFE (2) Example 4 Comparative 0.000020 8 PTFE PTFE (2)Example 5

TABLE 1-5 Evaluation Amount of metal impurity eluted Amount of organicimpurity eluted From liquid contact portion From liquid contact portionFrom liquid contact portion of storage tank of first connection memberof first connection member (based on mass) (based on mass) (based onmass) Example 1 <1 ppt <1 ppt <1 ppt Example 2 <1 ppt <1 ppt <1 pptExample 3 <1 ppt <1 ppt <1 ppt Example 4 <1 ppt <1 ppt <1 ppt Example 5<1 ppt <1 ppt <1 ppt Example 6 <1 ppt <1 ppt <1 ppt Example 7 <1 ppt <1ppt <1 ppt Example 8 <1 ppt <1 ppt <1 ppt Example 9 <1 ppt <1 ppt <1 pptExample 10 <1 ppt <1 ppt <1 ppt Example 11 <1 ppt <1 ppt <1 ppt Example12 <1 ppt <1 ppt <1 ppt Example 13 <2 ppt  1 ppb  1 ppb Example 14 <1ppt  1 ppm  1 ppm Example 15  5 ppt <1 ppt <1 ppt Example 16  1 ppm <1ppt <1 ppt Example 17 <1 ppt <1 ppt <1 ppt Example 18 <1 ppt <1 ppt <1ppt Example 19 <1 ppt <1 ppt <1 ppt Example 20 <1 ppt <1 ppt <1 pptExample 21 <1 ppt <1 ppt <1 ppt Example 22 <1 ppt <1 ppt <1 ppt Example23 <1 ppt <1 ppt <1 ppt Example 24 <1 ppt <1 ppt <1 ppt Example 25 <1ppt <1 ppt <1 ppt Comparative <1 ppt <1 ppt <1 ppt Example 1 Comparative<1 ppt <1 ppt <1 ppt Example 2 Comparative <1 ppt <1 ppt <1 ppt Example3 Comparative <1 ppt <1 ppt <1 ppt Example 4 Comparative <1 ppt <1 ppt<1 ppt Example 5

TABLE 1-6 Evaluation Temporal stability of Temporal change of content ofmetal impurity chemical liquid Evaluation of chemical liquid asdeveloper After 100 days After 200 days After 300 days After 300 daysDefect inhibition (Mass ppt) (Mass ppt) (Mass ppt) Change of componentDevelopability performance Example 1 18 18 18 A A AA Example 2 39 39 39A A A Example 3 48 48 48 A A B Example 4 22 22 22 A A A Example 5 20 2020 A A C Example 6 19 19 19 A A B Example 7 20 20 20 A A B Example 8 1919 19 A A AA Example 9 23 23 23 A A AA Example 10 18 18 18 A A AAExample 11 26 63 100 A B A Example 12 65 158 562 A C A Example 13 25 63100 A A B Example 14 65 158 562 A A C Example 15 20 30 55 A A B Example16 36 86 123 A A C Example 17 25 25 25 A A C Example 18 23 23 23 A A CExample 19 20 20 20 A A AA Example 20 20 20 20 A A AA Example 21 22 2222 A A B Example 22 22 22 22 B A A Example 23 22 22 22 A B C Example 2418 18 18 A B A Example 25 26 26 26 A B B Comparative 662 680 697 A B DExample 1 Comparative 20 22 23 A D AA Example 2 Comparative 78 189 612 AC D Example 3 Comparative 20 20 20 A B D Example 4 Comparative 70 166574 A D D Example 5

TABLE 2-1 Organic impurity Organic solvent Organic Alcohol Contentimpurity impurity (% by (Mass ppm) (mass ppm) [B]/ Type mass) [A] [B][A] Example 26 PGMEA Balance 500 25 0.05 Example 27 PGMEA Balance 500 250.05 Example 28 PGMEA Balance 500 25 0.05 Example 29 PGMEA Balance 300025 0.01 Example 30 PGMEA Balance 8000 25 0.003 Example 31 PGMEA Balance1000 25 0.03 Example 32 PGMEA Balance 1500 25 0.02 Example 33 EL Balance500 30 0.06 Example 34 GBL Balance 500 20 0.04 Example 35 PGME Balance500 20 0.04 Example 36 CyPe Balance 500 20 0.04 Example 37 CyHe Balance500 20 0.04 Example 38 PGMEA Balance 500 100 0.2 Example 39 PGMEABalance 500 200 0.4 Example 40 PGMEA Balance 500 25 0.05 Example 41PGMEA Balance 500 25 0.05 Example 42 PGMEA Balance 500 25 0.05 Example43 PGMEA Balance 500 25 0.05 Example 44 PGMEA Balance 500 25 0.05Example 45 PGMEA Balance 500 25 0.05 Example 46 CHdMA Balance 500 250.05 Example 47 HBM Balance 500 25 0.05 Example 48 CyPe/ 30/ 500 25 0.05PGMEA Balance Example 49 GBL/ 30/ 500 25 0.05 PGMEA Balance Example 50nBA Balance 500 25 0.05 Example 51 nBA Balance 500 25 0.05 Example 52nBA Balance 500 25 0.05 Comparative PGMEA Balance 500 25 0.05 Example 6Comparative PGMEA Balance 0.05 0.03 0.60 Example 7 Comparative PGMEABalance 15000 1500 0.10 Example 8 Comparative PGMEA Balance 3000 0.10.00003 Example 9 Comparative PGMEA Balance 1500 1400 0.93 Examnle 10

TABLE 2-2 Metal atoms contained in metal impurity Fe Cr Ni Mass MassMass ratio ratio ratio Content (Fe/ Content (Cr/ Content (Ni/ (Mass ppt)total) (Mass ppt) total) (Mass ppt) total) Example 26 2 0.12 1 0.06 20.12 Example 27 10 0.27 3 0.08 9 0.24 Example 28 14 0.30 4 0.09 14 0.30Example 29 2 0.10 1 0.05 3 0.14 Example 30 2 0.11 1 0.05 3 0.16 Example31 3 0.17 1 0.06 3 0.17 Example 32 3 0.17 1 0.06 4 0.22 Example 33 30.16 1 0.05 2 0.11 Example 34 3 0.14 1 0.05 3 0.14 Example 35 2 0.12 10.06 3 0.18 Example 36 2 0.11 2 0.11 3 0.16 Example 37 8 0.28 2 0.07 40.14 Example 38 2 0.12 1 0.06 3 0.18 Example 39 8 0.28 2 0.07 4 0.14Example 40 2 0.11 1 0.06 4 0.22 Example 41 3 0.14 1 0.05 3 0.14 Example42 2 0.09 1 0.04 4 0.17 Example 43 2 0.11 1 0.05 3 0.16 Example 44 20.11 1 0.05 2 0.11 Example 45 2 0.11 1 0.06 2 0.11 Example 46 10 0.28 30.08 9 0.25 Example 47 10 0.26 3 0.08 9 0.23 Example 48 10 0.28 3 0.08 90.25 Example 49 10 0.25 3 0.08 9 0.23 Example 50 3 0.15 1 0.05 4 0.20Example 51 2 0.10 1 0.05 3 0.14 Example 52 2 0.10 1 0.05 3 0.14Comparative 153 0.26 112 0.19 145 0.25 Example 6 Comparative 2 0.13 10.06 2 0.13 Example 7 Comparative 3 0.16 1 0.05 2 0.11 Example 8Comparative 2 0.11 1 0.05 3 0.16 Example 9 Comparative 2 0.11 1 0.06 30.17 Example 10

TABLE 2-3 Metal atoms contained in metal impurity Pb Others Mass MassWater ratio ratio Total content Content (Pb/ Content (Others/ (Mass (%By (Mass ppt) total) (Mass ppt) total) ppt) mass) Example 26 1 0.06 110.65 17 0.10% Example 27 3 0.08 12 0.32 37 0.10% Example 28 3 0.06 120.26 47 0.10% Example 29 1 0.05 14 0.67 21 0.10% Example 30 1 0.05 120.63 19 0.10% Example 31 1 0.06 10 0.56 18 0.10% Example 32 1 0.06 90.50 18 0.10% Example 33 1 0.05 12 0.63 19 0.10% Example 34 1 0.05 130.62 21 0.10% Example 35 1 0.06 10 0.59 17 0.10% Example 36 1 0.05 110.58 19 0.10% Example 37 3 0.10 12 0.41 29 0.10% Example 38 1 0.06 100.59 17 0.10% Example 39 3 0.10 12 0.41 29 0.10% Example 40 1 0.06 100.56 18 0.10% Example 41 1 0.05 13 0.62 21 0.10% Example 42 1 0.04 150.65 23 0.10% Example 43 1 0.05 12 0.63 19 0.10% Example 44 1 0.05 130.68 19 1.50% Example 45 1 0.06 12 0.67 18 0.10% Example 46 3 0.08 110.31 36 0.10% Example 47 3 0.08 14 0.36 39 0.10% Example 48 3 0.08 110.31 36 0.10% Example 49 3 0.08 15 0.38 40 0.10% Example 50 1 0.05 110.55 20 0.07% Example 51 1 0.05 14 0.67 21 0.10% Example 52 1 0.05 140.67 21 0.10% Comparative 106 0.18 68 0.12 584 0.10% Example 6Comparative 1 0.06 10 0.63 16 0.10% Example 7 Comparative 1 0.05 12 0.6319 0.10% Example 8 Comparative 1 0.05 12 0.63 19 0.10% Example 9Comparative 1 0.06 11 0.61 18 0.10% Example 10

TABLE 2-4 Physical properties of chemical liquid Material of liquidHigh-boiling- Number of contact portion point compound/ coarse Firstlow-boiling- particles Storage connection point compound (number/ml)tank member Example 26 0.000010 8 PTFE PTFE (2) Example 27 0.000010 15PTFE PTFE (2) Example 28 0.000010 23 PTFE PTFE (2) Example 29 0.000040 7PTFE PTFE (2) Example 30 0.000090 6 PTFE PTFE (2) Example 31 0.000180 7PTFE PTFE (2) Example 32 0.001001 6 PTFE PTFE (2) Example 33 0.000010 7PTFE PTFE (2) Example 34 0.000010 6 PTFE PTFE (2) Example 35 0.000010 6PTFE PTFE (2) Example 36 0.000010 6 PTFE PTFE (2) Example 37 0.000010 8PTFE PTFE (2) Example 38 0.000010 8 PTFE PP Example 39 0.000010 8 PTFESUS (1) Example 40 0.000010 8 PP PTFE (2) Example 41 0.000010 8 SUS (1)PTFE (2) Example 42 0.000010 8 SUS (1) SUS (1) Example 43 0.000010 8PTFE PTFE (2) Example 44 0.000010 8 SUS (2) PTFE (2) Example 45 0.000010165 PTFE (2) PTFE (2) Example 46 0.000010 15 SUS (2) PTFE (2) Example 470.000010 15 PTFE (2) PTFE (2) Example 48 0.000010 15 PTFE (2) PTFE (2)Example 49 0.000010 15 PTFE PTFE (2) Example 50 0.000020 8 PTFE PTFE (2)Example 51 0.000007 7 PTFE PTFE (2) Example 52 0.0020 7 PTFE PTFE (2)Comparative 0.000010 256 PTFE PTFE (2) Example 6 Comparative 0.000010 7PTFE PTFE (2) Example 7 Comparative 0.000010 7 PTFE PTFE (2) Example 8Comparative 0.000010 7 PTFE PTFE (2) Example 9 Comparative 0.000010 8PTFE PTFE (2) Example 10

TABLE 2-5 Evaluation Amount of metal impurity eluted Amount of organicimpurity eluted From liquid contact portion From liquid contact portionFrom liquid contact portion of storage tank of first conection member offirst connection member (based on mass) (based on mass) (based on mass)Example 26 <1 ppt <1 ppt <1 ppt Example 27 <1 ppt <1 ppt <1 ppt Example28 <1 ppt <1 ppt <1 ppt Example 29 <1 ppt <1 ppt <1 ppt Example 30 <1ppt <1 ppt <1 ppt Example 31 <1 ppt <1 ppt <1 ppt Example 32 <1 ppt <1ppt <1 ppt Example 33 <1 ppt <1 ppt <1 ppt Example 34 <1 ppt <1 ppt <1ppt Example 35 <1 ppt <1 ppt <1 ppt Example 36 <1 ppt <1 ppt <1 pptExample 37 <1 ppt <1 ppt <1 ppt Example 38 <2 ppt  1 ppb  1 ppb Example39 <1 ppt  1 ppm  1 ppm Example 40  5 ppt <1 ppt <1 ppt Example 41  1ppm <1 ppt <1 ppt Example 42  5 ppm  5 ppm  5 ppm Example 43  1 ppm <1ppt <1 ppt Example 44 <1 ppt <1 ppt <1 ppt Example 45 <1 ppt <1 ppt <1ppt Example 46 <1 ppt <1 ppt <1 ppt Example 47 <1 ppt <1 ppt <1 pptExample 48 <1 ppt <1 ppt <1 ppt Example 49 <1 ppt <1 ppt <1 ppt Example50 <1 ppt <1 ppt <1 ppt Example 51 <1 ppt <1 ppt <1 ppt Example 52 <1ppt <1 ppt <1 ppt Comparative <1 ppt <1 ppt <1 ppt Example 6 Comparative<1 ppt <1 ppt <1 ppt Example 7 Comparative <1 ppt <1 ppt <1 ppt Example8 Comparative <1 ppt <1 ppt <1 ppt Example 9 Comparative <1 ppt <1 ppt<1 ppt Example 10

TABLE 2-6 Evaluation Evaluation of chemical liquid as Temporal change ofcontent of metal impurity prewet solution After 100 days After 200 daysAfter 300 days Defect inhibition (Mass ppt) (Mass ppt) (Mass ppt)Developability performance Example 26 19 19 19 A AA Example 27 40 40 40A A Example 28 53 53 53 A B Example 29 24 24 24 A A Example 30 22 22 22A C Example 31 20 20 20 A B Example 32 20 20 20 A B Example 33 21 21 21A AA Example 34 22 22 22 A AA Example 35 19 19 19 A AA Example 36 20 2020 A AA Example 37 30 30 30 A AA Example 38 25 63 100 B A Example 39 65158 562 C A Example 40 30 63 100 A B Example 41 65 158 562 A C Example42 30 55 69 A B Example 43 36 86 123 A C Example 44 21 21 21 A C Example45 22 22 22 A C Example 46 39 39 39 A A Example 47 40 40 40 A A Example48 38 38 38 A A Example 49 42 42 42 A A Example 50 25 25 25 A B Example51 22 22 22 A A Example 52 22 22 22 B C Comparative 586 588 592 B DExample 6 Comparative 17 18 20 D AA Example 7 Comparative 80 198 622 C DExample 8 Comparative 20 20 20 B D Example 9 Comparative 72 168 580 D DExample 10

As is evident from the results shown in Table 1 and Table 2, thechemical liquids according to the examples had the effects of thepresent invention. In contrast, the chemical liquids according to thecomparative examples did not have the effects of the present invention.

Compared to the chemical liquids of Example 24 and Example 25, thechemical liquid described in Example 1, in which the metal impuritycontained a Fe atom, a Ni atom, a Cr atom, and a Pb atom, the mass ratioof the content of the Fe atom to the total content of the metal atomswas 0.01 to 0.5, the mass ratio of the content of the Cr atom to thetotal content of the metal atoms was 0.01 to 0.5, the mass ratio of thecontent of the Ni atom to the total content of the metal atoms was 0.01to 0.5, and the mass ratio of the content of the Pb atom to the totalcontent of the metal atoms was 0.005 to 0.3, had further improvedeffects of the present invention.

The chemical liquid of Example 1, in which the mass ratio of the totalcontent of the component having a boiling point equal to or higher than250° C. to the total content of the component having a boiling pointlower than 250° C. in the chemical liquid was 0.00001 to 0.001, hadfurther improved defect inhibition performance compared to the chemicalliquid of Example 23 (in which the mass ratio was greater than the upperlimit) and the chemical liquid of Example 22 (in which the mass ratiowas less than the lower limit). Furthermore, the chemical liquid ofExample 1 had further improved temporal stability compared to thechemical liquid of Example 22.

The chemical liquid of Example 1, in which the content of water in thechemical liquid with respect to the total mass of the chemical liquidwas 0.1% to 1.5% by mass, had further improved defect inhibitionperformance compared to the chemical liquid of Example 17 (in which thecontent of water was greater than the upper limit) and the chemicalliquid of Example 21 (in which the content of water was less than thelower limit).

The chemical liquid of Example 1, in which the number of objects to becounted having a size equal to or greater than 0.1 μm that were countedby a light scattering-type liquid-borne particle counter was equal to orsmaller than 100/mL, had further improved defect inhibition performancecompared to the chemical liquid of Example 18.

The chemical liquid transfer method of Example 1, in which the liquidcontact portion, contacting the chemical liquid, of at least one kind ofconstituent selected from the group consisting of the in-vehicle tank,the storage tank, and the first connection member was formed of anonmetallic material or electropolished stainless steel, allowed thetransferred chemical liquid to have further improved defect inhibitionperformance compared to the chemical liquid transfer methods of Example14 and Example 16.

The chemical liquid of Example 19 was evaluated in terms of “Temporalchange of total content of metal atoms in chemical liquid stored instorage tank” and “Temporal stability of chemical liquid stored instorage tank” under the condition in which the void volume of thestorage tank was changed. All of the results from Examples 1 to 52 andComparative Examples 1 to 10 were obtained by performing evaluation at avoid volume of 15%. The void volume is determined by the followingEquation (1).Void volume={1−(volume of the chemical liquid in the storagetank/container volume of the storage tank)}×100  Equation (1):

TABLE 3 Temporal stability Temporal change of content of metal impurityof chemical liquid Void volume After 100 days After 200 days After 300days After 300 days (% By volume) (Mass ppt) (Mass ppt) (Mass ppt)Change of component Example 19-1 0.01 20 36 72 B Example 19-2 0.1 20 3250 B Example 19-3 0.5 20 24 27 A Example 19-4 1 20 21 21 A Example 19-510 20 20 20 A Example 19-6 20 20 21 21 A Example 19-7 30 20 23 30 AExample 19-8 40 20 25 34 B Example 19-9 50 20 26 38 B Example 19-10 0 2041 85 C Example 19-11 55 20 48 92 C

Example 3-A

In the preparation of the chemical liquid of Example 3, the chemicalliquid contact portions in the device and members used were repeatedlywashed with the chemical liquid 1, and after it was confirmed that thecontent of the metal atoms contained in the metal impurity contained inthe chemical liquid used for washing was less than 0.001 ppm, a chemicalliquid was prepared. As a result, the content of the metal atomscontained in the metal impurity could be reduced by 20% compared to thechemical liquid of Example 3.

Example 3-B

In Example 3-A, the number of times of washing was reduced, and after itwas confirmed that the content of the metal atoms contained in the metalimpurity contained in the chemical liquid used for washing was less than0.1 ppm, a chemical liquid was prepared. As a result, the same effectsas those of Example 3-A were obtained.

Example 3-C

In Example 3-A, the number of times of washing was reduced, and after itwas confirmed that the content of the metal atoms contained in the metalimpurity contained in the chemical liquid used for washing was less than10 ppm, a chemical liquid was prepared. As a result, the content of themetal atoms contained in the metal impurity could be reduced by 10%compared to the chemical liquid of Example 3.

Example 1-A

A chemical liquid was prepared and evaluated in the same manner as inExample 1, except that a mixed solvent of nBA and isoamyl acetate (7:3,mass ratio) was used instead of nBA. As a result, the same effects asthose of Example 1 were obtained.

EXPLANATION OF REFERENCES

-   -   100: tank lorry    -   101: in-vehicle tank    -   102: storage tank    -   103: first connection member    -   104: valve    -   105: lorry joint nozzle    -   106: joint instrument    -   107: flange joint    -   108: valve    -   109: pipe line    -   200: manufacturing building    -   201: supply tank    -   202: pipe line    -   203: valve    -   204: pump    -   205: second connection member    -   206: device    -   207: pipe line    -   208: valve    -   209: pump    -   210: third connection member    -   211: filter

What is claimed is:
 1. A chemical liquid comprising: an organic solvent;a metal impurity; and an organic impurity, wherein the metal impuritycontains metal atoms, the total content of the metal atoms in thechemical liquid with respect to the total mass of the chemical liquid isequal to or smaller than 50 mass ppt, the total content of the organicimpurity in the chemical liquid with respect to the total mass of thechemical liquid is 0.1 to 1500 mass ppm, the organic impurity containsan alcohol impurity, the mass ratio of the content of the alcoholimpurity to the total content of the organic impurity is 0.0001 to 0.5,and the organic solvent contains at least one compound selected from thegroup consisting of propylene glycol monomethyl ether, propylene glycolmonoethyl ether, propylene glycol monopropyl ether, propylene glycolmonomethyl ether acetate, hexyl alcohol, 2-heptanone, isoamyl acetate,cyclohexanone, γ-butyrolactone, 2-hydroxymethyl butyrate, andcyclohexanone dimethyl acetal.
 2. The chemical liquid according to claim1, wherein the metal impurity contains a Fe atom, a Ni atom, a Cr atom,and a Pb atom, the mass ratio of the content of the Fe atom to the totalcontent of the metal atoms is 0.01 to 0.5, the mass ratio of the contentof the Cr atom to the total content of the metal atoms is 0.01 to 0.5,the mass ratio of the content of the Ni atom to the total content of themetal atoms is 0.01 to 0.5, and the mass ratio of the content of the Pbatom to the total content of the metal atoms is 0.005 to 0.3.
 3. Thechemical liquid according to claim 1, wherein the content of water inthe chemical liquid with respect to the total mass of the chemicalliquid is 0.1% to 1.5% by mass.
 4. The chemical liquid according toclaim 1, wherein the number of objects to be counted having a size equalto or greater than 0.1 μm that are counted by a light scatteringliquid-borne particle counter is equal to or smaller than 100/mL.
 5. Thechemical liquid according to claim 1, wherein the organic solvent has aboiling point lower than 200° C.
 6. A chemical liquid storage bodycomprising: a storage tank; and the chemical liquid according to claim 1that is stored in the storage tank, wherein a liquid contact portioncontacting the chemical liquid in the storage tank is formed of anonmetallic material or electropolished stainless steel.
 7. The chemicalliquid storage body according to claim 6, wherein the nonmetallicmaterial is at least one kind of material selected from the groupconsisting of a polyethylene resin, a polypropylene resin, apolyethylene-polypropylene resin, polytetrafluoroethylene, atetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, atetrafluoroethylene-hexafluoropropylene copolymer resin, atetrafluoroethylene-ethylene copolymer resin, a chlorotrifluoroethylene-ethylene copolymer resin, a vinylidene fluoride resin, achlorotrifluoroethylene copolymer resin, and a vinyl fluoride resin. 8.A chemical liquid filling method for filling a storage tank with thechemical liquid according to claim 1 by transferring the chemical liquidto the storage tank from a tank lorry including a tank storing thechemical liquid, comprising: a step of connecting the tank and thestorage tank to each other through a first connection member; and a stepof filling the storage tank with the chemical liquid in the tank bytransferring the chemical liquid to the storage tank through the firstconnection member.
 9. The chemical liquid filling method according toclaim 8, wherein the first connection member is a member satisfying acondition 1 or a condition 2 described below, condition 1: under acondition in which a ratio of a mass of the first connection member to avolume of the chemical liquid transferred to and filled into the storagetank becomes 10% provided that a liquid temperature of the chemicalliquid is 25° C., in a case where the first connection member isimmersed for 1 week in the chemical liquid having a liquid temperatureof 25° C., the total content of the metal atoms contained in the metalimpurity eluted into the chemical liquid is equal to or smaller than 1.0mass ppt, condition 2: under a condition in which a ratio of a mass ofthe first connection member to a volume of the chemical liquidtransferred to and filled into the storage tank becomes 10% providedthat a liquid temperature of the chemical liquid is 25° C., in a casewhere the first connection member is immersed for 1 week in the chemicalliquid having a liquid temperature of 25° C., the total content of theorganic impurity eluted into the chemical liquid is equal to or smallerthan 1.0 mass ppt.
 10. The chemical liquid filling method according toclaim 8, wherein a liquid contact portion, which contacts the chemicalliquid, of at least one kind of constituent selected from the groupconsisting of the tank, the storage tank, and the first connectionmember is formed of a nonmetallic material or electropolished stainlesssteel.
 11. The chemical liquid filling method according to claim 10,wherein the nonmetallic material is at least one kind of materialselected from the group consisting of a polyethylene resin, apolypropylene resin, a polyethylene-polypropylene resin,polytetrafluoroethylene, a tetrafluoroethylene-perfluoroalkyl vinylether copolymer, a tetrafluoroethylene-hexafluoropropylene copolymerresin, a tetrafluoroethylene-ethylene copolymer resin, a chlorotrifluoroethylene-ethylene copolymer resin, a vinylidene fluoride resin, achlorotrifluoroethylene copolymer resin, and a vinyl fluoride resin. 12.The chemical liquid filling method according to claim 8, furthercomprising: a step of transferring the chemical liquid, which has beentransferred to and filled into the storage tank, to a supply tank, whichis connected to the storage tank through a second connection member,through the second connection member such that the supply tank is filledwith the chemical liquid.
 13. The chemical liquid filling methodaccording to claim 12, wherein a liquid contact portion, which contactsthe chemical liquid, of at least one kind of constituent selected fromthe group consisting of the supply tank and the second connection memberis formed of a nonmetallic material or electropolished stainless steel.14. The chemical liquid filling method according to claim 13, whereinthe nonmetallic material is at least one kind of material selected fromthe group consisting of a polyethylene resin, a polypropylene resin, apolyethylene-polypropylene resin, polytetrafluoroethylene, atetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, atetrafluoroethylene-hexafluoropropylene copolymer resin, atetrafluoroethylene-ethylene copolymer resin, a chlorotrifluoroethylene-ethylene copolymer resin, a vinylidene fluoride resin, achlorotrifluoroethylene copolymer resin, and a vinyl fluoride resin. 15.The chemical liquid filling method according to claim 12, furthercomprising: a step of transferring the chemical liquid, which has beentransferred to and filled into the supply tank, to a device, which isconnected to the supply tank through a third connection member, throughthe third connection member such that the device is filled with thechemical liquid.
 16. The chemical liquid filling method according toclaim 15, wherein a liquid contact portion, which contacts the chemicalliquid, of at least one kind of constituent selected from the groupconsisting of the device and the third connection member is formed of anonmetallic material or electropolished stainless steel.
 17. Thechemical liquid filling method according to claim 16, wherein thenonmetallic material is at least one kind of material selected from thegroup consisting of a polyethylene resin, a polypropylene resin, apolyethylene-polypropylene resin, polytetrafluoroethylene, atetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, atetrafluoroethylene-hexafluoropropylene copolymer resin, atetrafluoroethylene-ethylene copolymer resin, a chlorotrifluoroethylene-ethylene copolymer resin, a vinylidene fluoride resin, achlorotrifluoroethylene copolymer resin, and a vinyl fluoride resin. 18.The chemical liquid filling method according to claim 15, wherein thethird connection member includes at least one kind of filter.
 19. Achemical liquid storage method for storing the chemical liquid accordingto claim 1 that is stored in a storage tank, comprising: an adjustmentstep of adjusting at least one kind of item selected from the groupconsisting of a temperature of the chemical liquid, an internal pressureof the storage tank, and a relative humidity of a headspace portion inthe storage tank.
 20. The chemical liquid storage method according toclaim 19, wherein a liquid contact portion, which contacts the chemicalliquid, of the storage tank is formed of a nonmetallic material orelectropolished stainless steel.
 21. The chemical liquid storage methodaccording to claim 20, wherein the nonmetallic material is at least onekind of material selected from the group consisting of a polyethyleneresin, a polypropylene resin, a polyethylene-polypropylene resin,polytetrafluoroethylene, a tetrafluoroethylene-perfluoroalkyl vinylether copolymer, a tetrafluoroethylene-hexafluoropropylene copolymerresin, a tetrafluoroethylene-ethylene copolymer resin, a chlorotrifluoroethylene-ethylene copolymer resin, a vinylidene fluoride resin, achlorotrifluoroethylene copolymer resin, and a vinyl fluoride resin. 22.The chemical liquid storage method according to claim 19, wherein theadjustment step has a step of adjusting the temperature to be 10° C. to30° C., a step of adjusting the internal pressure to be 0.1 to 1.0 MPa,and a step of adjusting the relative humidity to be 30% to 90%.
 23. Thechemical liquid according to claim 1, wherein the metal impuritycontains a Ni atom, and the mass ratio of the content of the Ni atom tothe total content of the metal atoms is 0.08 to 0.5.
 24. A chemicalliquid comprising: an organic solvent; a metal impurity; and an organicimpurity, wherein the metal impurity contains metal atoms, the totalcontent of the metal atoms in the chemical liquid with respect to thetotal mass of the chemical liquid is equal to or smaller than 50 massppt, the total content of the organic impurity in the chemical liquidwith respect to the total mass of the chemical liquid is 0.1 to 1500mass ppm, the organic impurity contains an alcohol impurity, the massratio of the content of the alcohol impurity to the total content of theorganic impurity is 0.0001 to 0.5, the mass ratio of the total contentof a component having a boiling point equal to or higher than 250° C. tothe total content of a component having a boiling point lower than 250°C. in the chemical liquid is 0.00001 to 0.001, and the organic solventcontains at least one compound selected from the group consisting ofpropylene glycol monomethyl ether, propylene glycol monoethyl ether,propylene glycol monopropyl ether, propylene glycol monomethyl etheracetate, hexyl alcohol, 2-heptanone, isoamyl acetate, cyclohexanone,γ-butyrolactone, 2-hydroxymethyl butyrate, and cyclohexanone dimethylacetal.
 25. The chemical liquid according to claim 24, wherein the metalimpurity contains a Fe atom, a Ni atom, a Cr atom, and a Pb atom, themass ratio of the content of the Fe atom to the total content of themetal atoms is 0.01 to 0.5, the mass ratio of the content of the Cr atomto the total content of the metal atoms is 0.01 to 0.5, the mass ratioof the content of the Ni atom to the total content of the metal atoms is0.01 to 0.5, and the mass ratio of the content of the Pb atom to thetotal content of the metal atoms is 0.005 to 0.3.
 26. The chemicalliquid according to claim 24, wherein the content of water in thechemical liquid with respect to the total mass of the chemical liquid is0.1% to 1.5% by mass.
 27. The chemical liquid according to claim 24,wherein the number of objects to be counted having a size equal to orgreater than 0.1 μm that are counted by a light scattering liquid-borneparticle counter is equal to or smaller than 100/mL.
 28. The chemicalliquid according to claim 24, wherein the organic solvent has a boilingpoint lower than 200° C.
 29. A chemical liquid storage body comprising:a storage tank; and the chemical liquid according to claim 24 that isstored in the storage tank, wherein a liquid contact portion contactingthe chemical liquid in the storage tank is formed of a nonmetallicmaterial or electropolished stainless steel.
 30. The chemical liquidstorage body according to claim 29, wherein the nonmetallic material isat least one material selected from the group consisting of apolyethylene resin, a polypropylene resin, a polyethylene-polypropyleneresin, polytetrafluoroethylene, a tetrafluoroethylene-perfluoroalkylvinyl ether copolymer, a tetrafluoroethylene-hexafluoropropylenecopolymer resin, a tetrafluoroethylene-ethylene copolymer resin, achlorotrifluoro ethylene-ethylene copolymer resin, a vinylidene fluorideresin, a chlorotrifluoroethylene copolymer resin, and a vinyl fluorideresin.
 31. A chemical liquid storage method for storing the chemicalliquid according to claim 24 that is stored in a storage tank,comprising: an adjustment step of adjusting at least one item selectedfrom the group consisting of a temperature of the chemical liquid, aninternal pressure of the storage tank, and a relative humidity of aheadspace portion in the storage tank.
 32. The chemical liquid storagemethod according to claim 31, wherein a liquid contact portion, whichcontacts the chemical liquid, of the storage tank is formed of anonmetallic material or electropolished stainless steel.
 33. Thechemical liquid storage method according to claim 32, wherein thenonmetallic material is at least one material selected from the groupconsisting of a polyethylene resin, a polypropylene resin, apolyethylene-polypropylene resin, polytetrafluoroethylene, atetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, atetrafluoroethylene-hexafluoropropylene copolymer resin, atetrafluoroethylene-ethylene copolymer resin, a chlorotrifluoroethylene-ethylene copolymer resin, a vinylidene fluoride resin, achlorotrifluoroethylene copolymer resin, and a vinyl fluoride resin. 34.The chemical liquid storage method according to claim 31, wherein theadjustment step has a step of adjusting the temperature to be 10° C. to30° C., a step of adjusting the internal pressure to be 0.1 to 1.0 MPa,and a step of adjusting the relative humidity to be 30% to 90%.
 35. Thechemical liquid according to claim 24, wherein the metal impuritycontains a Ni atom, and the mass ratio of the content of the Ni atom tothe total content of the metal atoms is 0.08 to 0.5.